Abstract: A laminate includes a first glass article having a first thickness, a first annealing point (TA1), and a first softening point (TS1), a second glass article having a second thickness, a second annealing point (TA2), and a second softening point (TS2), and an interlayer disposed between the first glass article and the second glass article. The first thickness is greater than the second thickness, the second annealing point (TA2) is less than or equal to the first annealing point (TA1), and the second softening point (TS2) is greater than the first softening point (TS1).

Abstract: An electronic device may include an antenna and a coaxial cable coupled to the antenna. The coaxial cable may have a signal conductor coupled to an antenna resonating element of the antenna and a ground conductor coupled to an antenna ground of the antenna. The ground conductor may include an ungrounded segment that is separated from the antenna ground by a gap. A capacitive coupling between the ground conductor in the ungrounded segment and the antenna ground via the gap may form an impedance matching component for the coaxial cable. A dielectric retention layer may overlap the coaxial cable and hold the coaxial cable in place relative to the antenna ground to maintain the gap.

Abstract: A plasma assisted spark ignition system includes an ignitor and a power supply. The first ignitor includes: a casing having a first end, a second end that forms a first electrode, and a longitudinally extending passage, a second electrode which protrudes longitudinally outward from an opening at the second end of the casing and laterally spaced inwardly to form a spark gap, and an electrical insulator (dielectric) surrounding a portion of the second electrode, and which has a terminus that is at least closely spaced to an interior surface of the end of the casing. The power supply supplies a plurality of voltage pulses to the ignitor per ignition event to generate a flash over on the dielectric. Subsequent pulses in an ignition event may be at lower amplitude than an initial pulse in the ignition event. Pulses may, for example, have a duration on the order of a nanosecond.

Abstract: An apparatus for controlling backlighting of an electronic display, such as a liquid crystal display (LCD) panel. The apparatus may synchronize a power cycle of one or more light-emitting diode (LED) strings to a frame rate of the LCD panel.

Abstract: A method of CMP of the semiconductor device where the method comprises the sequential steps of providing a semiconductor device, forming a copper layer on the semiconductor device and planarizing the copper layer with a medium. The medium comprises an abrasive component and a chemical solution. The chemical solution comprises water, an oxidizing agent, a first coordinating ligand adapted to form a complex with Cu(I) and a second coordinating ligand adapted to form a complex with Cu(II).

Abstract: A method for chemical mechanical polishing (CMP) a copper layer (22) begins by forming the copper layer (22). The copper layer (22) is then exposed to a slurry (24). The slurry (24) contains an oxidizing agent such as H.sub.2 O.sub.2, a carboxylate salt such as ammonium citrate, an abrasive slurry such as alumna abrasive, an optional triazole or triazole derivative, and a remaining balance of a solvent such as deionized water. The use of the slurry (24) polishes the copper layer (22) with a high rate of removal whereby pitting and corrosion of the copper layer (22) is reduced and good copper interconnect planarity is achieved. This slurry (24) has good selectivity of copper to oxide, and results in copper devices which have good electrical performance. In addition, disposal of the slurry (24) is not environmentally difficult since the slurry (24) is environmentally sound when compared to other prior art slurries.