Abstract: A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.

Abstract: A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.

Abstract: An optical sensor device includes: a display layer, comprising a light source configured to generate light incident on an input surface of the optical sensor device; an image sensor layer, disposed below the display layer, comprising an optical image sensor having a plurality of image sensor pixels; and a first ambient light filter layer, disposed between the display layer and the image sensor layer, configured to block one or more wavelengths of light.

Abstract: Disclosed is a sensor device comprising: a two-dimensional array of sensor pixel circuits, wherein the two-dimensional array includes a first axis and second axis, and wherein the two-dimensional array includes more sensor pixel circuits along the second axis than along the first axis; a gate drive circuit disposed along on the first axis of the two-dimensional array configured to drive one or more sensor pixel circuits; and, a readout circuit disposed along on the first axis of the two-dimensional array configured to receive output information from the one or more sensor pixel circuits.

Abstract: An optical sensor device includes: a display layer, comprising a light source configured to generate light incident on an input surface of the optical sensor device; an image sensor layer, disposed below the display layer, comprising an optical image sensor having a plurality of image sensor pixels; and a first ambient light filter layer, disposed between the display layer and the image sensor layer, configured to block one or more wavelengths of light.

Abstract: Disclosed is a sensor device comprising: a two-dimensional array of sensor pixel circuits, wherein the two-dimensional array includes a first axis and second axis, and wherein the two-dimensional array includes more sensor pixel circuits along the second axis than along the first axis; a gate drive circuit disposed along on the first axis of the two-dimensional array configured to drive one or more sensor pixel circuits; and, a readout circuit disposed along on the first axis of the two-dimensional array configured to receive output information from the one or more sensor pixel circuits.

Abstract: Disclosed are optical sensors, optical fingerprint sensor packages, and methods for forming same. An optical sensor comprises: a substrate; an image sensor disposed over the substrate; a light source disposed over the substrate; a light guide disposed over the image sensor; and, an encapsulant disposed over the light source, wherein the encapsulant is coupled to the light guide and comprises a surface positioned to reflect light emitted from the light source and direct the reflected light into the light guide.

Abstract: Methods and systems for integrating image sensor structures with collimator filters, including manufacturing methods and associated structures for forming collimator filters at the wafer level for integration with image sensor semiconductor wafers. Methods of making an optical biometric sensor include forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer, and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors.

Abstract: An optical biometric sensor is disclosed. The optical biometric sensor includes a filter layer having a top surface and a bottom surface. The filter layer includes a light filter including a blocking material forming an array of apertures; a substrate including an electrical interconnect comprising a set of electrical conductors. The biometric sensor further includes an optical sensor including an array of sensing elements mounted to the bottom surface of the substrate, wherein sensing elements in the array of sensing elements sensors are aligned with the array of apertures and electrically connected to the electrical interconnect.

Abstract: An optical biometric sensor is disclosed. The optical biometric sensor includes a filter layer having a top surface and a bottom surface. The filter layer includes a light filter including a blocking material forming an array of apertures; a substrate including an electrical interconnect comprising a set of electrical conductors. The biometric sensor further includes an optical sensor including an array of sensing elements mounted to the bottom surface of the substrate, wherein sensing elements in the array of sensing elements sensors are aligned with the array of apertures and electrically connected to the electrical interconnect.

Abstract: Disclosed are optical sensors, optical fingerprint sensor packages, and methods for forming same. An optical sensor comprises: a substrate; an image sensor disposed over the substrate; a light source disposed over the substrate; a light guide disposed over the image sensor; and, an encapsulant disposed over the light source, wherein the encapsulant is coupled to the light guide and comprises a surface positioned to reflect light emitted from the light source and direct the reflected light into the light guide.

Abstract: Methods and systems for integrating image sensor structures with collimator filters, including manufacturing methods and associated structures for forming collimator filters at the wafer level for integration with image sensor semiconductor wafers. Methods of making an optical biometric sensor include forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer, and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.