Patents by Inventor Jason Goodelle

Jason Goodelle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210064090
    Abstract: A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 4, 2021
    Inventors: Shengmin WEN, Qing XIAO, Jason GOODELLE, Joseph Kurth REYNOLDS
  • Patent number: 10921855
    Abstract: A semiconductor assembly for a display device comprises a display driver integrated circuit (DDIC) chip and an interposer coupled to the DDIC chip. The DDIC chip comprises a plurality of output pads and a plurality of input pads. Further, the DDIC chip is configured to drive a plurality of data lines of the display device to update an active region of the display device. The interposer comprises a plurality of output pads coupled to the plurality of output pads of the DDIC chip and is configured to be coupled to the plurality of data lines of the display device. The interposer further comprises a plurality of input pads coupled to the plurality of input pads of the DDIC chip pads. Further, a width of the interposer is at least as large as a distance between outermost data lines of the plurality of data lines.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: February 16, 2021
    Assignee: Synaptics Incorporated
    Inventors: Shengmin Wen, Qing Xiao, Jason Goodelle, Joseph Kurth Reynolds
  • Patent number: 10796128
    Abstract: An optical sensor device includes: a display layer, comprising a light source configured to generate light incident on an input surface of the optical sensor device; an image sensor layer, disposed below the display layer, comprising an optical image sensor having a plurality of image sensor pixels; and a first ambient light filter layer, disposed between the display layer and the image sensor layer, configured to block one or more wavelengths of light.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: October 6, 2020
    Assignee: FINGERPRINT CARDS AB
    Inventors: Arash Akhavan Fomani, Marek Mienko, Richard Klenkler, Patrick Smith, Robert J. Gove, Guozhong Shen, Alvin Jee, Young Seen Lee, Jason Goodelle, Bob Lee Mackey
  • Patent number: 10503955
    Abstract: Disclosed is a sensor device comprising: a two-dimensional array of sensor pixel circuits, wherein the two-dimensional array includes a first axis and second axis, and wherein the two-dimensional array includes more sensor pixel circuits along the second axis than along the first axis; a gate drive circuit disposed along on the first axis of the two-dimensional array configured to drive one or more sensor pixel circuits; and, a readout circuit disposed along on the first axis of the two-dimensional array configured to receive output information from the one or more sensor pixel circuits.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: December 10, 2019
    Assignee: Synaptics Incorporated
    Inventors: Stephen Morein, Guozhong Shen, Jason Goodelle
  • Publication number: 20190180072
    Abstract: An optical sensor device includes: a display layer, comprising a light source configured to generate light incident on an input surface of the optical sensor device; an image sensor layer, disposed below the display layer, comprising an optical image sensor having a plurality of image sensor pixels; and a first ambient light filter layer, disposed between the display layer and the image sensor layer, configured to block one or more wavelengths of light.
    Type: Application
    Filed: December 12, 2018
    Publication date: June 13, 2019
    Inventors: Arash Akhavan Fomani, Marek Mienko, Richard Klenkler, Patrick Smith, Robert J. Gove, Guozhong Shen, Alvin Jee, Young Seen Lee, Jason Goodelle, Bob Lee Mackey
  • Publication number: 20190065814
    Abstract: Disclosed is a sensor device comprising: a two-dimensional array of sensor pixel circuits, wherein the two-dimensional array includes a first axis and second axis, and wherein the two-dimensional array includes more sensor pixel circuits along the second axis than along the first axis; a gate drive circuit disposed along on the first axis of the two-dimensional array configured to drive one or more sensor pixel circuits; and, a readout circuit disposed along on the first axis of the two-dimensional array configured to receive output information from the one or more sensor pixel circuits.
    Type: Application
    Filed: June 1, 2018
    Publication date: February 28, 2019
    Inventors: Stephen Morein, Guozhong Shen, Jason Goodelle
  • Patent number: 10185866
    Abstract: Disclosed are optical sensors, optical fingerprint sensor packages, and methods for forming same. An optical sensor comprises: a substrate; an image sensor disposed over the substrate; a light source disposed over the substrate; a light guide disposed over the image sensor; and, an encapsulant disposed over the light source, wherein the encapsulant is coupled to the light guide and comprises a surface positioned to reflect light emitted from the light source and direct the reflected light into the light guide.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: January 22, 2019
    Assignee: Synaptics Incorporated
    Inventors: Jason Goodelle, Paul Wickboldt, Young Seen Lee, Chien Lam, Bob Lee Mackey
  • Patent number: 10147757
    Abstract: Methods and systems for integrating image sensor structures with collimator filters, including manufacturing methods and associated structures for forming collimator filters at the wafer level for integration with image sensor semiconductor wafers. Methods of making an optical biometric sensor include forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer, and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: December 4, 2018
    Assignee: Synaptics Incorporated
    Inventors: Young Seen Lee, Paul Wickboldt, Patrick Smith, Robert John Gove, Jason Goodelle
  • Patent number: 10055637
    Abstract: An optical biometric sensor is disclosed. The optical biometric sensor includes a filter layer having a top surface and a bottom surface. The filter layer includes a light filter including a blocking material forming an array of apertures; a substrate including an electrical interconnect comprising a set of electrical conductors. The biometric sensor further includes an optical sensor including an array of sensing elements mounted to the bottom surface of the substrate, wherein sensing elements in the array of sensing elements sensors are aligned with the array of apertures and electrically connected to the electrical interconnect.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: August 21, 2018
    Assignee: Synaptics Incorporated
    Inventors: James MacDonald, Jason Goodelle
  • Publication number: 20180157889
    Abstract: An optical biometric sensor is disclosed. The optical biometric sensor includes a filter layer having a top surface and a bottom surface. The filter layer includes a light filter including a blocking material forming an array of apertures; a substrate including an electrical interconnect comprising a set of electrical conductors. The biometric sensor further includes an optical sensor including an array of sensing elements mounted to the bottom surface of the substrate, wherein sensing elements in the array of sensing elements sensors are aligned with the array of apertures and electrically connected to the electrical interconnect.
    Type: Application
    Filed: December 7, 2016
    Publication date: June 7, 2018
    Inventors: James MacDonald, Jason Goodelle
  • Publication number: 20170083745
    Abstract: Disclosed are optical sensors, optical fingerprint sensor packages, and methods for forming same. An optical sensor comprises: a substrate; an image sensor disposed over the substrate; a light source disposed over the substrate; a light guide disposed over the image sensor; and, an encapsulant disposed over the light source, wherein the encapsulant is coupled to the light guide and comprises a surface positioned to reflect light emitted from the light source and direct the reflected light into the light guide.
    Type: Application
    Filed: September 19, 2016
    Publication date: March 23, 2017
    Inventors: Jason Goodelle, Paul Wickboldt, Young Seen Lee, Chien Lam, Bob Lee Mackey
  • Publication number: 20160254312
    Abstract: Methods and systems for integrating image sensor structures with collimator filters, including manufacturing methods and associated structures for forming collimator filters at the wafer level for integration with image sensor semiconductor wafers. Methods of making an optical biometric sensor include forming a collimator filter layer on an image sensor wafer, wherein a plurality of light collimating apertures in the collimator filter layer are aligned with a plurality of light sensing elements in the image sensor wafer, and after forming the collimator filter layer on the image sensor wafer, singulating the image sensor wafer into a plurality of individual optical sensors.
    Type: Application
    Filed: March 31, 2016
    Publication date: September 1, 2016
    Inventors: Young Seen Lee, Paul Wickboldt, Patrick Smith, Robert John Gove, Jason Goodelle
  • Patent number: 9048811
    Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
    Type: Grant
    Filed: May 1, 2013
    Date of Patent: June 2, 2015
    Assignee: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Alexei Gaidarzhy, Guiti Zolfagharkhani, Jason Goodelle
  • Patent number: 9030080
    Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: May 12, 2015
    Assignee: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Pritiraj Mohanty, Klaus Juergen Schoepf, Guiti Zolfagharkhani, Jason Goodelle, Reimund Rebel
  • Patent number: 8698376
    Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: April 15, 2014
    Assignee: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Pritiraj Mohanty, Klaus Juergen Schoepf, Guiti Zolfagharkhani, Jason Goodelle, Reimund Rebel
  • Publication number: 20130313947
    Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
    Type: Application
    Filed: May 1, 2013
    Publication date: November 28, 2013
    Applicant: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Alexei Gaidarzhy, Guiti Zolfagharkhani, Jason Goodelle
  • Patent number: 8587183
    Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: November 19, 2013
    Assignee: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Pritiraj Mohanty, Klaus Juergen Schoepf, Guiti Zolfagharkhani, Jason Goodelle, Reimund Rebel
  • Patent number: 8476809
    Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: July 2, 2013
    Assignee: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Pritiraj Mohanty, Klaus Juergen Schoepf, Guiti Zolfagharkhani, Jason Goodelle, Reimund Rebel
  • Patent number: 8466606
    Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
    Type: Grant
    Filed: October 6, 2010
    Date of Patent: June 18, 2013
    Assignee: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Alexei Gaidarzhy, Guiti Zolfagharkhani, Jason Goodelle
  • Publication number: 20130140651
    Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
    Type: Application
    Filed: November 20, 2012
    Publication date: June 6, 2013
    Applicant: Sand 9, Inc.
    Inventors: David M. Chen, Jan H. Kuypers, Pritiraj Mohanty, Klaus Juergen Schoepf, Guiti Zolfagharkhani, Jason Goodelle, Reimund Rebel