Abstract: A heatsink system includes a heatsink plate having a first set of slots defined in a first face thereof and a second set of slots defined in a second face thereof opposite the first face. The first and second sets of slots are configured to house phase change material (PCM) therein.

Abstract: A heatsink can include a body, one or more thermal fin arrays defined by and/or extending from the body, and a phase change material disposed in contact with the one or more fin arrays. The phase change material can be configured to be a first phase in a cool state and a second phase in a heated state. The phase change material is configured to be cooled back to the solid state.

Abstract: In accordance with at least one aspect of this disclosure, a system includes a reinforcement structure configured to seat in an air gap between one or more solder balls of a ball grid array of a surface mount packaging component. The reinforcement structure is configured and reduce bending of the circuit board during acceleration of the circuit board.

Abstract: In accordance with at least one aspect of this disclosure, a thermal management system for an electronics assembly includes, a reservoir housing a compressible fluid in a compressed state, a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid, and a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice.

Abstract: In accordance with at least one aspect of this disclosure, an actuation system for a guided munition, includes a reservoir disposed in a guided munition body housing a compressible fluid in a compressed state, a fluid path connecting the reservoir in fluid communication with a heat exchange volume, a throttling orifice disposed in the fluid path configured to expand the compressible fluid, and an actuation path connecting the heat exchange volume in fluid communication with a moveable component. The actuation path can be configured to supply pneumatic pressure to the moveable components.

Abstract: A heatsink system includes a heatsink plate having a first set of slots defined in a first face thereof and a second set of slots defined in a second face thereof opposite the first face. The first and second sets of slots are configured to house phase change material (PCM) therein.

Abstract: A system includes a guided munition having a housing. A first reservoir is defined within the housing holding a first chemical reactant. A second reservoir is defined within the housing, wherein the second reservoir holds a second chemical reactant configured to undergo an endothermic reaction with the first chemical reactant. A frangible barrier separates between the first and second reservoirs. The frangible barrier is configured to break under forces acting on the guided munition as the guided munition is fired from a weapon. An electronic device can be housed within the housing in thermal contact with at least one of the first reservoir and/or second reservoir for cooling the electronic device with an endothermic reaction upon mixing of the first and second chemical reactants.

Abstract: In accordance with at least one aspect of this disclosure, a system includes one or more electronics boards and one or more plates configured to interleave the one or more electronics boards in a stack along an axis. When in the stack, an outer surface of the one or more plates is configured to form an outer mold line of a portion of a moving platform. Each of the one or more plates includes an inner diameter and an outer diameter, where the outer surface has an outer circumference at the outer diameter.

Abstract: In accordance with at least one aspect of this disclosure, a system includes a reinforcement structure configured to seat in an air gap between one or more solder balls of a ball grid array of a surface mount packaging component. The reinforcement structure is configured and reduce bending of the circuit board during acceleration of the circuit board.

Abstract: In certain embodiments, an imaging system includes an enclosure with an objective aperture opening into an interior space of the enclosure, an optical assembly optically coupling the objective aperture to an imaging sensor within the enclosure, a spatial light modulator (SLM) mounted to the objective aperture for selectively blocking and admitting illumination through the objective aperture into the interior space, and an illuminator mounted to illuminate the interior space of the enclosure.

Abstract: In accordance with at least one aspect of this disclosure, a thermal management system for an electronics assembly includes, a reservoir housing a compressible fluid in a compressed state, a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid, and a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice.

Abstract: In accordance with at least one aspect of this disclosure, an actuation system for a guided munition, includes a reservoir disposed in a guided munition body housing a compressible fluid in a compressed state, a fluid path connecting the reservoir in fluid communication with a heat exchange volume, a throttling orifice disposed in the fluid path configured to expand the compressible fluid, and an actuation path connecting the heat exchange volume in fluid communication with a moveable component. The actuation path can be configured to supply pneumatic pressure to the moveable components.

Abstract: A heatsink can include a body, one or more thermal fin arrays defined by and/or extending from the body, and a phase change material disposed in contact with the one or more fin arrays. The phase change material can be configured to be a first phase in a cool state and a second phase in a heated state. The phase change material is configured to be cooled back to the solid state.

Abstract: A guided munition system includes a munition body including at least one fluid dynamic control for changing course of the munition body in flight. A seeker onboard the munition body is operatively connected to control the at least one fluid dynamic control. The seeker includes a coded aperture imaging device facing outward from the munition body for image based control for guiding the munition body in flight.

Abstract: In certain embodiments, an imaging system includes an enclosure with an objective aperture opening into an interior space of the enclosure, an optical assembly optically coupling the objective aperture to an imaging sensor within the enclosure, a shutter mounted to the objective aperture for selectively blocking and admitting illumination through the objective aperture into the interior space, and an illuminator mounted to illuminate the interior space of the enclosure.

Abstract: In certain embodiments, an imaging system includes an enclosure with an objective aperture opening into an interior space of the enclosure, an optical assembly optically coupling the objective aperture to an imaging sensor within the enclosure, a spatial light modulator (SLM) mounted to the objective aperture for selectively blocking and admitting illumination through the objective aperture into the interior space, and an illuminator mounted to illuminate the interior space of the enclosure.

Abstract: A method includes forming a first image of a scene through a static coded aperture onto a sensor with the static coded aperture in a first position relative to the sensor, shifting the coded aperture to a second position relative to the sensor, and forming a second image of the scene through the static coded aperture onto the sensor with the static coded aperture in the second position. Two or more images can be formed in this way. The method includes forming a combined image by deconvolving the two or more images and combining data from the two or more images into the combined image. The combined image can be a more accurate representation of the scene than either of the first and second images.

Abstract: A system includes a guided munition having a housing. A first reservoir is defined within the housing holding a first chemical reactant. A second reservoir is defined within the housing, wherein the second reservoir holds a second chemical reactant configured to undergo an endothermic reaction with the first chemical reactant. A frangible barrier separates between the first and second reservoirs. The frangible barrier is configured to break under forces acting on the guided munition as the guided munition is fired from a weapon. An electronic device can be housed within the housing in thermal contact with at least one of the first reservoir and/or second reservoir for cooling the electronic device with an endothermic reaction upon mixing of the first and second chemical reactants.

Abstract: A guided munition system includes a munition body including at least one fluid dynamic control for changing course of the munition body in flight. A seeker onboard the munition body is operatively connected to control the at least one fluid dynamic control. The seeker includes a coded aperture imaging device facing outward from the munition body for image based control for guiding the munition body in flight.

Abstract: A stacked circuit card assembly includes a power supply having a positive terminal and a negative terminal, a first circuit card having a first via electrically connected to the positive terminal and a second via electrically connected to the negative terminal, and a second circuit card having a third via aligned with the first via and a fourth via aligned with the second via. The assembly further includes a first conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card, and a second conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card. The first conductive stand-off provides a conductive pathway between the first via and the third via, and the second conductive stand-off provides a conductive pathway between the second via and the fourth via.