Abstract: Transient voltages are not propagated through a P-channel MOSFET used as a switch with output slew rate control feedback, by connecting a low or near-zero impedance across the source and gate terminals of the device whenever the MOSFET is supposed to be off. The low or near-zero impedance is provided by a second P-channel MOSFET connected across the source and gate of the MOSFET switch.

Abstract: Transient voltages are not propagated through a P-channel MOSFET used as a switch with output slew rate control feedback, by connecting a low or near-zero impedance across the source and gate terminals of the device whenever the MOSFET is supposed to be off. The low or near-zero impedance is provided by a second P-channel MOSFET connected across the source and gate of the MOSFET switch.

Abstract: An electrically noisy D.C. power source having high slew rate A.C. transient voltage, is cut off from a capacitive load by a switchable, constant slew rate voltage source, upon the detection of an A.C. transient voltage having a slew rate that would otherwise cause a current overload through the capacitive load or the voltage source, or the D.C. power source.

Abstract: An electrically noisy D.C. power source having high slew rate A.C. transient voltage, is cut off from a capacitive load by a switchable, constant slew rate voltage source, upon the detection of an A.C. transient voltage having a slew rate that would otherwise cause a current overload through the capacitive load or the voltage source, or the D.C. power source.

Abstract: A method, apparatus and a system, for provided for performing an automated process flow adjustment. A semiconductor wafer is processed based upon a routing plan and a predetermined schedule. A fault detection relating to the processing of the semiconductor wafer is performed. Dynamically modifying the predetermined routing plan or the predetermined schedule based upon the fault detection. A predetermined process material delivery plan is dynamically modified based upon the modifying of the routing plan or modifying of the predetermined schedule.

Abstract: Management of move requests from a factory system to an automated handling system (AMHS) is provided. In one embodiment, a method and system is provided which includes receiving a move request from the factory system and selectively passing the move request to the AMHS based on a comparison of the move request with one or more conditions of the AMHS. The move request may be selectively passed to the AMHS by, for example, passing the move request to the AMHS without modification, changing a destination tool identified in the move request and/or delaying the move request, or canceling the move request. By selectively passing the move request based on conditions of the AMHS, move requests can more efficiently be managed and the throughput of the automated material handling system can be increased.

Abstract: A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.

Abstract: A method and apparatus for determining a possible cause of a fault in a semiconductor fabrication process. The method includes determining a first fault in a first processing tool executing under first operating conditions and determining a second fault in a second processing tool executing under second operating conditions. The method further includes identifying a possible source of the second fault based on at least the first operating conditions of the first processing tool.

Abstract: A method and apparatus is provided for creating a process recipe based on a desired result. The method comprises providing at least one workpiece to a processing tool for processing, providing the desired result for the workpiece to the processing tool, and generating a recipe for processing the workpiece based on the desired result.

Abstract: Wafer processing cycle times are substantially reduced by predicting and correcting downstream processing location anomalies before a wafer lot is released to the next processing location on the processing line. In an example embodiment, a method of verifying downstream processing line readiness in a semiconductor processing facility having a material handling system includes presenting a wafer lot to a first application processing location. A signal is then sent to a second application processing location to verify readiness by simulating the second application processing on the wafer lot. The availability or operating status of the second processing location is then communicated to the material handling system, the material handling system communicating instructions to the first processing location on where to send the wafer lot after the processing simulation is complete. The readiness verification method is repeated until the wafer lot is completely processed.

Abstract: A method, apparatus, and system is provided for a proactive dispatch system to improve line balancing. At least one request for processing a semiconductor wafer is received. A line-balancing analysis based upon the request is performed. At least one semiconductor wafer based upon the line-balancing analysis is processed.

Abstract: A method for measuring defects includes receiving a defect characteristic measurement for each measurement site in a first subset of a plurality of measurement sites on a workpiece. A second subset of the plurality of measurement sites is defined. The size of the second subset is based on the defect characteristic measurements of the first subset of the plurality of measurement sites. A metrology tool is directed to measure the defect characteristic at each of the measurement site in the second subset responsive to the size of the second subset being greater than zero. A system includes a metrology tool and a controller. The metrology tool is configured to measure a defect characteristic at each of a first plurality of measurement sites on a workpiece.

Abstract: A method and a system for managing the movement of material lots through a semiconductor fabrication facility. In an example embodiment of the method, the movement of the material lots is tracked and a business rules module is accessed that generates material movement directives as a function of event changes on the line and externally provided directives that change the material lot movement sequence. Material lots are then rearranged in the material handling system as a function of a carrier code and the directive indicating a change. The result is a fabrication process that is more responsive and flexible with respect to internal or external changing conditions.

Abstract: Management of move requests from a factory system to an automated handling system (AMHS) is provided. In one embodiment, a method and system is provided which includes receiving a move request from the factory system and selectively passing the move request to the AMHS based on a comparison of the move request with one or more conditions of the AMHS. The move request may be selectively passed to the AMHS by, for example, passing the move request to the AMHS without modification, changing a destination tool identified in the move request and/or delaying the move request, or canceling the move request. By selectively passing the move request based on conditions of the AMHS, move requests can more efficiently be managed and the throughput of the automated material handling system can be increased.

Abstract: The present invention is generally directed to various methods for determining, tracking and/or controlling processing based upon wafer characteristics. In one embodiment, the method is directed to selecting a plurality of wafers from the group of wafers based upon the semiconductor device to be manufactured on the wafer and at least one characteristic of the wafers. In another embodiment, the method comprises identifying a source of wafers wherein the device metrology data lies outside of the preselected range based upon the wafer identification mark and the device metrology data. As yet another example, the method comprises determining at least one parameter of a process operation to be performed on a wafer in a processing tool based upon the determined wafer characteristics.