Patents by Inventor Jason Haag

Jason Haag has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inertial bonding method of forming a sputtering target assembly and assembly made therefrom
    Publication number: 20070084719
    Abstract: A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method can include bonding a sputtering target to a backing plate with the use of solder, braze metal, or alloys thereof, and reflowing the solder or braze metal after bonding the sputtering target to the backing plate.
    Type: Application
    Filed: September 26, 2006
    Publication date: April 19, 2007
    Inventors: Charles Wickersham, Jason Haag