Abstract: An optical sensing system includes a planar optical waveguide having a first surface for detection and a second surface for coupling light. The optical sensing system includes a functional layer integral with the first surface of the planar optical waveguide, and a coupling layer in contact with the second surface of the planar optical waveguide, the coupling layer having a lower refractive index than the planar optical waveguide. The optical sensing system includes an optical source arranged to illuminate at least a portion of the second surface of the planar optical waveguide through the coupling layer with substantially critical optical coupling. The optical sensing system also includes an optical detector arranged to receive a portion of light from the optical source after being reflected from the first surface of the planar optical waveguide and passing through the coupling layer.

Abstract: An optical sensing system includes a planar optical waveguide having a first surface for detection and a second surface for coupling light. The optical sensing system includes a functional layer integral with the first surface of the planar optical waveguide, and a coupling layer in contact with the second surface of the planar optical waveguide, the coupling layer having a lower refractive index than the planar optical waveguide. The optical sensing system includes an optical source arranged to illuminate at least a portion of the second surface of the planar optical waveguide through the coupling layer with substantially critical optical coupling. The optical sensing system also includes an optical detector arranged to receive a portion of light from the optical source after being reflected from the first surface of the planar optical waveguide and passing through the coupling layer.

Abstract: A wafer shipping box for carrying a number of wafers is provided. The wafer shipping box includes a main body, a cover and a sealing element. The cover can join up with the main body to seal off wafers inside the wafer shipping box. A vent hole is set up on either the body or the cover. The sealing element is used to seal or open the vent hole. Through the sealing element, the vent hole can be sealed so that micro-particles and corrosive gases are prevented from contaminating the wafers and the interior of the wafer box during shipment.

Abstract: A cleaning method to remove ink from the surface of a semiconductor wafer includes securing the wafer to a spin chuck, submerging the spinning wafer into an N-Methyl-Pyrolidone (NMP) solution to dissolve the ink on the surface of the semiconductor wafer, spraying a cleaning solution onto the surface of the spinning wafer to clean the ink off the surface of the wafer, and blowing gas onto the surface of the spinning wafer so as to remove residue from the surface of the wafer.

Abstract: The present invention provides a cleaning system for removing ink from the surface of a semiconductor wafer. The cleaning system comprises a first cleaning station, a second cleaning station and a drying station. The first cleaning station spins the wafer and uses an N-Methyl-Pyrolidone (NMP) solution to dissolve the ink on the surface of the semiconductor wafer. The second cleaning station also spins the wafer and uses another cleaning solution to clean the ink off the surface of the wafer. The drying station spins the wafer and uses a gas to blow the surface of the wafer so as to remove residue from the surface of the wafer.

Abstract: A cleaning method to remove ink from the surface of a semiconductor wafer includes securing the wafer to a spin chuck, submerging the spinning wafer into an N-Methyl-Pyrolidone (NMP) solution to dissolve the ink on the surface of the semiconductor wafer, spraying a cleaning solution onto the surface of the spinning wafer to clean the ink off the surface of the wafer, and blowing gas onto the surface of the spinning wafer so as to remove residue from the surface of the wafer.

Abstract: The invention describes a wafer protective container for holding integrated circuit (IC) wafers. The wafer protective container comprises a container body, a locking device, a container cover, and a plurality of fasteners assembled together to prevent movement of the IC wafers during transportation. The container body has at least an opening to allow easy loading and unloading of the IC wafers, while the locking device is used to keep the IC wafers in position in the container body. The container cover, which covers the container body, provides more protection for the IC wafers. The container cover has a plurality of notches to enhance ease of opening the IC wafer protective container. Since the fasteners can secure the container cover to the container body, a seal between the container cover and the container body is not broken as a result of rigorous movement during transportation, thus reducing the risk of contaminating the IC wafers.

Abstract: A storage box is provided for the safe-keeping of fabricated or semi-fabricated semiconductor wafers. This wafer storage box allows the wafers to be tightly secured in position when held in the storage box for storage or shipping without the possibility of breaking the wafers as in the prior art. The wafer storage box includes a receptacle member having a first piece of soft material such as anti-static sponge on the inside thereof, a holding member which is accommodated in the receptacle member, and a covering member having a second piece of soft material such as anti-static sponge on the inside thereof. When the covering member is mounted on the receptacle member, the first and second pieces of anti-static sponge are disposed on opposite sides of the holding member, thus pressing against the wafers to secure them in position in the storage box.

Abstract: A cuboid wafer container consists of a top bucket and a bottom bucket. The top bucket further consists of a square bucket and a cylindrical bucket, the same does the bottom bucket. The cylindrical bucket and the square bucket are connected through cushion to absorb vibration for protect the wafers from being damaged by the vibration. The wafer container according to the invention can be opened and sealed without screwing the buckets, so that damages occurred on the surfaces of wafers is reduced.