Patents by Inventor Jason K. Walleser

Jason K. Walleser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110100347
    Abstract: Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7 to 50 at %, at least one non-metal or metalloid selected from the group consisting of boron, carbon, silicon, phosphorus, and/or nitrogen present in the range of about 1 to 35 at %, and one metal selected from the group consisting of copper, titanium, molybdenum, aluminum, and/or chromium present in the range of about 0 to 25 at %, wherein the wire has an aspect ratio of greater than one and exhibits metallic and/or crystalline phases of less than 500 nm in size.
    Type: Application
    Filed: November 2, 2010
    Publication date: May 5, 2011
    Applicant: THE NANOSTEEL COMPANY, INC.
    Inventors: Daniel James BRANAGAN, Brian E. MEACHAM, Jason K. WALLESER, Jikou ZHOU, Alla V. SERGUEEVA, David PARATORE
  • Publication number: 20100203353
    Abstract: A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees C. A solder joint and solder process embody the solder alloy as well as solder balls and solder paste made therefrom to provide a solidified joint that includes three different intermetallic phases and a Sn metal phase. An exemplary Sn—Ag—Cu—Mn alloy consists essentially of about 3 to about 4 weight % Ag, about 0.80 to about 1.0 weight % Cu, and about 0.05 to about 0.15 weight % Mn, and balance consisting essentially of Sn.
    Type: Application
    Filed: June 23, 2009
    Publication date: August 12, 2010
    Inventors: Iver E. Anderson, Joel Harringa, Jason K. Walleser