Abstract: An over-molded multi-optical ribbon fiber assembly comprises a housing over-mold including a middle section having first and second ends that branch into first legs and second legs, respectively. The assembly further comprises multiple sets of optical fibers. The optical fibers of all of the sets extend through the middle section as individual optical fibers in a non-ribbon fiber, stacked configuration. The optical fibers of each set further: extend through a respective first leg and a respective second leg of the housing; extend past a free-end of the respective first leg, and transition to a respective first ribbon fiber outside of the housing; and extend past a free-end of the respective second leg, and transition to a respective second ribbon fiber outside of the housing. The assembly further comprises multiple optical fiber connectors each terminating a respective one of the first and second ribbon fibers.

Abstract: An electronics housing system (S) adapted for electronic devices (D) includes a main chassis unit (M) and at least one removable module (10) mountable with the base unit (M) for supporting electronic circuitry components electro-optically coupled with the base unit (M). The removable module assembly (10) has a main body (12) that includes two opposing mounting edges (14, 16) and a connection edge (18). At least one of the mounting edges (14, 16) of the removable mounting assembly (10) has an opening (20) to receive a cooling air flow (F) into an interior cavity (22) of the main body (12) of the removable module (10). The main chassis (M) has a pair of opposing module mounting assemblies (24, 26) to receive a removable module (10) between the opposing module mounting assemblies (24, 26). The electronics rack wall (24, 26) includes a removable seal plate (32) to provide an air seal.

Abstract: An electronics housing system (S) adapted for electronic devices (D) includes a main chassis unit (M) and at least one removable module (10) mountable with the base unit (M) for supporting electronic circuitry components electro-optically coupled with the base unit (M). The removable module assembly (10) has a main body (12) that includes two opposing mounting edges (14, 16) and a connection edge (18). At least one of the mounting edges (14, 16) of the removable mounting assembly (10) has an opening (20) to receive a cooling air flow (F) into an interior cavity (22) of the main body (12) of the removable module (10). The main chassis (M) has a pair of opposing module mounting assemblies (24, 26) to receive a removable module (10) between the opposing module mounting assemblies (24, 26). The electronics rack wall (24, 26) includes a removable seal plate (32) to provide an air seal.