Patents by Inventor Jason L. Frankel
Jason L. Frankel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10949600Abstract: Embodiments of the invention include methods, systems, and computer program products for checking floating metals in a laminate structure. Aspects of the invention include receiving, by a processor, floating metal rules and a semiconductor package design having a plurality of laminate layers. Each laminate layer includes a plurality of metal shapes, a plurality of signal lines, and a plurality of vias. The metal shapes, signal lines, and vias are mapped to one or more cells in an array. The processor determines, for each cell corresponding to a metal shape, whether the plurality of vias satisfies the floating metal rules. The processor can suggest new vias to satisfy the floating metal rules.Type: GrantFiled: August 13, 2019Date of Patent: March 16, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jean Audet, Franklin M. Baez, Jason L. Frankel, Paul R. Walling
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Publication number: 20190362049Abstract: Embodiments of the invention include methods, systems, and computer program products for checking floating metals in a laminate structure. Aspects of the invention include receiving, by a processor, floating metal rules and a semiconductor package design having a plurality of laminate layers. Each laminate layer includes a plurality of metal shapes, a plurality of signal lines, and a plurality of vias. The metal shapes, signal lines, and vias are mapped to one or more cells in an array. The processor determines, for each cell corresponding to a metal shape, whether the plurality of vias satisfies the floating metal rules. The processor can suggest new vias to satisfy the floating metal rules.Type: ApplicationFiled: August 13, 2019Publication date: November 28, 2019Inventors: Jean Audet, Franklin M. Baez, Jason L. Frankel, Paul R. Walling
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Patent number: 10423751Abstract: Embodiments of the invention include methods, systems, and computer program products for checking floating metals in a laminate structure. Aspects of the invention include receiving, by a processor, floating metal rules and a semiconductor package design having a plurality of laminate layers. Each laminate layer includes a plurality of metal shapes, a plurality of signal lines, and a plurality of vias. The metal shapes, signal lines, and vias are mapped to one or more cells in an array. The processor determines, for each cell corresponding to a metal shape, whether the plurality of vias satisfies the floating metal rules. The processor can suggest new vias to satisfy the floating metal rules.Type: GrantFiled: September 29, 2017Date of Patent: September 24, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jean Audet, Franklin M. Baez, Jason L. Frankel, Paul R. Walling
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Patent number: 10375820Abstract: A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.Type: GrantFiled: March 22, 2018Date of Patent: August 6, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling, Roger D. Weekly
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Publication number: 20190102505Abstract: Embodiments of the invention include methods, systems, and computer program products for checking floating metals in a laminate structure. Aspects of the invention include receiving, by a processor, floating metal rules and a semiconductor package design having a plurality of laminate layers. Each laminate layer includes a plurality of metal shapes, a plurality of signal lines, and a plurality of vias. The metal shapes, signal lines, and vias are mapped to one or more cells in an array. The processor determines, for each cell corresponding to a metal shape, whether the plurality of vias satisfies the floating metal rules. The processor can suggest new vias to satisfy the floating metal rules.Type: ApplicationFiled: September 29, 2017Publication date: April 4, 2019Inventors: Jean Audet, Franklin M. Baez, Jason L. Frankel, Paul R. Walling
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Publication number: 20180213636Abstract: A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.Type: ApplicationFiled: March 22, 2018Publication date: July 26, 2018Inventors: JINWOO CHOI, SUNGJUN CHUN, JASON L. FRANKEL, PAUL R. WALLING, ROGER D. WEEKLY
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Patent number: 9955567Abstract: A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.Type: GrantFiled: July 27, 2014Date of Patent: April 24, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling, Roger D. Weekly
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Patent number: 8927879Abstract: A first selection of mesh line segments of a mesh layer are of a first width and a second selection of mesh line segments of the mesh layer are of a second width, wherein the second width is greater than the first width. The second selection of mesh line segments of the second width are positioned in parallel to a selection of signal lines in a signal layer that are likely to introduce crosstalk, wherein the widening of the mesh line segments shadowing the selection of signal lines increases the likelihood that the return current associated with the signal will flow in the wider mesh line segment, thereby increasing the likelihood of containing the electromagnetic fields associated with the signal such that crosstalk to other signals is reduced or contained.Type: GrantFiled: November 22, 2010Date of Patent: January 6, 2015Assignee: International Business Machines CorporationInventors: Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling, Roger D. Weekly
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Publication number: 20140331482Abstract: A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.Type: ApplicationFiled: July 27, 2014Publication date: November 13, 2014Inventors: JINWOO CHOI, SUNGJUN CHUN, JASON L. FRANKEL, PAUL R. WALLING, ROGER D. WEEKLY
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Publication number: 20120125677Abstract: A first selection of mesh line segments of a mesh layer are of a first width and a second selection of mesh line segments of the mesh layer are of a second width, wherein the second width is greater than the first width. The second selection of mesh line segments of the second width are positioned in parallel to a selection of signal lines in a signal layer that are likely to introduce crosstalk, wherein the widening of the mesh line segments shadowing the selection of signal lines increases the likelihood that the return current associated with the signal will flow in the wider mesh line segment, thereby increasing the likelihood of containing the electromagnetic fields associated with the signal such that crosstalk to other signals is reduced or contained.Type: ApplicationFiled: November 22, 2010Publication date: May 24, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling, Roger D. Weekly
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Patent number: 7806341Abstract: A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module.Type: GrantFiled: January 5, 2009Date of Patent: October 5, 2010Assignee: International Business Machines CorporationInventors: Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia, David C. Long, Frank L. Pompeo, Sudipta K. Ray
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Publication number: 20090145973Abstract: A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module.Type: ApplicationFiled: January 5, 2009Publication date: June 11, 2009Applicant: International Business Machines CorporationInventors: Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia, David C. Long, Frank L. Pompeo, Sudipta K. Ray
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Patent number: 7472836Abstract: A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.Type: GrantFiled: June 26, 2007Date of Patent: January 6, 2009Assignee: International Business Machines CorporationInventors: Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia, David C. Long, Frank L. Pompeo, Sudipta K. Ray
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Patent number: 7281667Abstract: A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.Type: GrantFiled: April 14, 2005Date of Patent: October 16, 2007Assignee: International Business Machines CorporationInventors: Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D Kadakia, David C. Long, Frank L. Pompeo, Sudipta K. Ray
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Patent number: 7096451Abstract: A method, system and program product implementing storage of a (power or ground) mesh plane file using a multiple line shape, possibly with the storage of lines also, to reduce file size. In addition, the invention implements an activate-substantial-portion-and-remove technique to generate mesh planes rather than the conventional additive approach, which improves the speed of designing the IC carriers. A resulting mesh plane design file may be as much as half the size of a file generated using the conventional line-by-line and storage approaches.Type: GrantFiled: September 9, 2003Date of Patent: August 22, 2006Assignee: International Business Machines CorporationInventors: Alice L. Donaldson, Jason L. Frankel, John A. Ludwig, Kenneth A. Papae, Rafael Perez-Acevedo, C. Timothy Ryan, Paul R. Walling
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Patent number: 5831810Abstract: An electronic component package comprising a substrate having at least one die-receiving cavity formed therein, the cavity being defined by a die-receiving surface and an inner sidewall having a terraced contour, the substrate having an exterior surface bordering the cavity perimeter, the inner sidewall extending between the die-receiving surface and the substrate exterior surface, and at least one capacitor positioned completely within the cavity and mounted to the terraced contour of the inner sidewall.Type: GrantFiled: August 21, 1996Date of Patent: November 3, 1998Assignee: International Business Machines CorporationInventors: Kenneth A. Bird, Peter J. Brofman, Francis F. Cappo, Jr., Jason L. Frankel, Suresh D. Kadakia, Sarah Huffsmith Knickerbocker, Scott A. Sikorski