Abstract: An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.

Abstract: Systems and methods for assembling microelectronic devices that have a base die and a conventional wire-bond die stacked on the base die. In one embodiment of a method in accordance with the invention, a base die is placed on a substrate and then a first stacked die is subsequently stacked on the base die. The first stacked die is stacked on the base die in a single pass through a die attach machine without first storing or otherwise processing the base die/substrate assembly in a separate machine. The stacked die, moreover, can be stacked onto the base die before heating the base die to reflow a solder or otherwise attach the base die to the substrate. After stacking the first stacked die on the base die, the complete die assembly can be heated to (a) secure the base die to the substrate, and (b) secure the first stacked die to the base die.

Abstract: An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.

Abstract: An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.

Abstract: An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.

Abstract: A microelectronic substrate assembly and method for manufacture. In one embodiment, bond members (such as solder balls) project away from a surface of the microelectronic substrate to define a fill region or cavity between the surface of the microelectronic substrate and the bond members. A fill material is disposed in the fill region, for example, by dipping the microelectronic substrate in reservoir of fill material so that a portion of the fill material remains attached to the microelectronic substrate. An exposed surface of the fill material is engaged with a support member, such as a printed circuit board, and the bond members are attached to corresponding bond pads on the support member. The microelectronic substrate and the fill material can then be encapsulated with an encapsulating material to form a device package.

Abstract: A microelectronic substrate assembly and method for manufacture. In one embodiment, bond members (such as solder balls) project away from a surface of the microelectronic substrate to define a fill region or cavity between the surface of the microelectronic substrate and the bond members. A fill material is disposed in the fill region, for example, by dipping the microelectronic substrate in reservoir of fill material so that a portion of the fill material remains attached to the microelectronic substrate. An exposed surface of the fill material is engaged with a support member, such as a printed circuit board, and the bond members are attached to corresponding bond pads on the support member. The microelectronic substrate and the fill material can then be encapsulated with an encapsulating material to form a device package.

Abstract: A microelectronic substrate assembly and method for manufacture. In one embodiment, bond members (such as solder balls) project away from a surface of the microelectronic substrate to define a fill region or cavity between the surface of the microelectronic substrate and the bond members. A fill material is disposed in the fill region, for example, by dipping the microelectronic substrate in reservoir of fill material so that a portion of the fill material remains attached to the microelectronic substrate. An exposed surface of the fill material is engaged with a support member, such as a printed circuit board, and the bond members are attached to corresponding bond pads on the support member. The microelectronic substrate and the fill material can then be encapsulated with an encapsulating material to form a device package.