Patents by Inventor Jason M. Kehl

Jason M. Kehl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die package having security features
    Patent number: 11688700
    Abstract: Methods and apparatus for providing an assembly including a base substrate, a lid substrate, and a ring frame between the base substrate and the lid substrate to define a protected volume, where the ring frame includes through vias. A die may be contained in the protected volume. Sensor circuitry can include conductive pillars in the protected volume and the die can include circuity to determine an impedance of the pad and the pillars for tamper detection. An edge cap can be coupled to at least one side of the assembly for tamper detection.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: June 27, 2023
    Assignee: RAYTHEON COMPANY
    Inventors: Jason M. Kehl, Jason G. Milne, Steve F. Mayrose, Aaron George
  • DIE PACKAGE HAVING SECURITY FEATURES
    Publication number: 20220399290
    Abstract: Methods and apparatus for providing an assembly including a base substrate, a lid substrate, and a ring frame between the base substrate and the lid substrate to define a protected volume, where the ring frame includes through vias. A die may be contained in the protected volume. Sensor circuitry can include conductive pillars in the protected volume and the die can include circuity to determine an impedance of the pad and the pillars for tamper detection. An edge cap can be coupled to at least one side of the assembly for tamper detection.
    Type: Application
    Filed: June 11, 2021
    Publication date: December 15, 2022
    Applicant: Raytheon Company
    Inventors: Jason M. Kehl, Jason G. Milne, Steve F. Mayrose, Aaron George