Patents by Inventor Jason M. Lombard

Jason M. Lombard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bundled wire device
    Patent number: 7825332
    Abstract: A bundled wire device having a first stranded wire, a second stranded wire, and a stranded copper ground wire, wherein the wires are simultaneously coated with a mesh sheath. The mesh sheaths allow heat from the first stranded wire, second stranded wire, and the stranded copper wire to dissipate. The bundled wire device has a third stranded wire also surrounded by the mesh sheath.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: November 2, 2010
    Inventor: Jason M. Lombard