Patents by Inventor Jason Mao

Jason Mao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to form decoupling capacitors on IC chip and the structure thereof
    Publication number: 20080076229
    Abstract: A method to form decoupling capacitors on an IC chip and the structure thereof includes forming several metal layers on a low-metal-covering-ratio region of the IC chip and connecting these metal layers to the ground, source voltage respectively, in order to form parasite metal capacitors that can be as decoupling capacitors with satisfying the metal covering rules so as to make good use of the IC chip space.
    Type: Application
    Filed: September 27, 2006
    Publication date: March 27, 2008
    Inventors: Jason Mao, James Yu Peng