Abstract: Medical devices and systems for treating a stricture, for example along the biliary and/or pancreatic tract, are disclosed. An example system may include a guidewire having a distal end and defining a lumen. A stiffening rod may be slidably disposed within the lumen. The stiffening rod may have a distal end and a distal end region disposed adjacent to the distal end. The stiffening rod may be configured to shift between a first position where the distal end of the stiffening rod is disposed proximally of the distal end of the guidewire and a second position where the distal end of the stiffening rod is disposed distally of the distal end of the guidewire.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.

Abstract: A system for cooling a plurality of electronic devices, having a first cooling circulatory arrangement, configured to cause a first liquid coolant to circulate between a first electronic device and a heat exchanger, wherein the first electronic device is thermally coupled to the first liquid coolant. The system also has a second cooling circulatory arrangement, configured to cause a second liquid coolant to flow through the heat exchanger, and to cause the second liquid coolant to flow through a cooling module thermally coupled to a second electronic device. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled via the heat exchanger, such that the heat exchanger is configured to transfer heat from the first liquid coolant to the second liquid coolant.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: A module is provided for housing electronic devices and a liquid coolant. The module comprises: a housing defining a sealable internal volume for containing the electronic devices and the liquid coolant, the sealable internal volume having a base; a substrate in the sealable internal volume approximately parallel to the base, one of the electronic devices being mounted on a side of the substrate proximal the base; and a heat sink device, comprising a receptacle part defining an internal volume that is arranged to receive the liquid coolant and accumulate the liquid coolant therein. The heat sink is mounted such that the one of the electronic devices or a component that is thermally conductively coupled to the one of the electronic devices is at least partially within the internal volume.

Abstract: A nozzle arrangement for cooling an electronic component. The nozzle arrangement comprises: a nozzle for discharging liquid coolant; and a mount configured to disperse the liquid coolant, the mount further configured to be coupled with the electronic component. The nozzle is coupled to the mount such that, in use, the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant;. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: Medical devices and systems for treating a stricture along the biliary and/or pancreatic tract are disclosed. An example medical device may include a guidewire for use along the biliary and/or pancreatic tract. The guidewire may include an elongate core member having a proximal end region and a distal end region. A coil member may be disposed along the distal end region. An actuation member may be coupled to the coil member. The actuation member may be configured to shift the coil member between a first configuration and a compressed configuration. The coil member may be configured to be advanced across a biliary and/or pancreatic stricture when in the compressed configuration. A sleeve may be disposed over the coil member.

Abstract: Medical devices and systems for treating a stricture, for example along the biliary and/or pancreatic tract, are disclosed. An example system may include a guidewire having a distal end and defining a lumen. A stiffening rod may be slidably disposed within the lumen. The stiffening rod may have a distal end and a distal end region disposed adjacent to the distal end. The stiffening rod may be configured to shift between a first position where the distal end of the stiffening rod is disposed proximally of the distal end of the guidewire and a second position where the distal end of the stiffening rod is disposed distally of the distal end of the guidewire.

Abstract: Systems and methods for treating a stricture, for example along the biliary and/or pancreatic tract, are disclosed. An example system may include a handle having a base, a first carriage translatable relative to the base, and a second carriage translatable relative to the base. A sheath may be coupled to the first carriage. The system may also include a catheter shaft having a proximal end region and a steerable distal end region. The proximal end region may be coupled to the second carriage. A needle may be releasably coupled to the handle. The needle may be configured to pass through tissue into a position along the biliary and/or pancreatic tract. The system may also include a steering member having a first end coupled to the steerable distal end region of the catheter shaft and a second end disposed adjacent to the handle.

Abstract: A system includes storage devices storing data units. Each data unit is stored on one of the storage devices. The system includes a processor, and a non-transitory computer-readable data storage medium storing computer-executable code. The processor executes the code to correlate workloads to the data units with respect to which of the workloads access which of the data units, and when the workloads access the data units. The processor executes the code to when the workloads access the data units and/or and on which of the storage devices the data units are stored, so that at given times the data units stored on a subset of the storage devices are not being accessed by any workload. The processor executes the code to, during each given time, power off the subset of the storage devices storing the data units that are not being accessed by any workload to conserve power.

Abstract: Cooling based on hardware activity patterns, including: identifying a hardware activity pattern associated with a system; determining, based on the hardware activity pattern, one or more cooling actions; and applying the one or more cooling actions to the system.

Abstract: Additional workloads are assigned among servers in a power-efficient manner. For each of a plurality of servers, a stored power efficiency/capacity utilization relationship is accessed, current component power consumption values are obtained, and a current power consumption efficiency is calculated. An amount of capacity utilization necessary to perform an additional workload is obtained, and a predicted power consumption efficiency is determined for each server. The predicted efficiency is determined using the current power consumption efficiency of the server and the stored relationship. The workload is then assigned to the server that would have the greatest improvement in power consumption efficiency.

Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

Abstract: Profiling operating efficiency deviations of a computing system includes: generating a profile of expected operating efficiency for a computing system in an ideal configuration; for each of a plurality of alternative configurations of the computing system, wherein each of the alternative configurations includes a variation of the ideal configuration that introduces a deviation in operating efficiency of the computing system, said variation comprising a root cause of the deviation: monitoring operating efficiency of the computing system identifying, from the monitored operating efficiency, a deviation of operating efficiency from the expected operating efficiency; and recording, in a data structure, an association of the deviation and the root cause of the deviation.

Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

Abstract: A cooling assembly for cooling a processor includes a heat sink base defining a first area and a second area, a plurality of heat sink fins extending from the first area, a thermoelectric cooling module having a cold side and hot side, wherein the cold side is in contact with the second area, and a heat sink module in contact with the hot side. In use, a method includes monitoring a processor parameter selected from processor power consumption and processor temperature, and causing airflow across the plurality of heat sink fins and the heat sink module. The method further includes powering on the thermoelectric cooling module in response to the processor parameter having a value greater than a first threshold value, and powering off the thermoelectric cooling module in response to the processor parameter having a value less than a second threshold value.