Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

Abstract: A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.

Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

Abstract: An apparatus including a contactor having a hole and including a radio frequency absorptive material and a probe inserted in the hole to couple a test signal to a device under test is disclosed. A test system for testing integrated circuits including a contactor including a radio frequency absorptive material is disclosed. A method for making the contactor is also disclosed.

Abstract: An apparatus and method for the manufacturing and use in a semiconductor test system is disclosed. The apparatus includes a signal probe and a dielectric sleeve surrounding the signal probe. A method includes forming a mold to receive a component of a contactor assembly, inserting the component into the mold, and forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process. The component includes one or more signal probe holes.

Abstract: A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

Abstract: A test contactor is disclosed. The test contactor includes two or more dielectric layers and a test probe embedded in the one or more dielectric layers. The test contactor traverses the one or more dielectric layers. The test probe to include an input signal port and an output signal port and the test probe to transmit a test signal from the input signal port to the output signal port.

Abstract: A test probe assembly includes a mounting fixture, a co-planar waveguide lead frame having a device contact point, where the co-planar waveguide lead frame is mounted to the mounting fixture, and at least one radio frequency (RF) connector assembly electrically coupled with the co-planar waveguide lead frame.

Abstract: A high speed circuit assembly includes a high speed circuit including at least one transmission line extending to a transmission line end, and radar absorbing material disposed adjacent the transmission line.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.

Abstract: An integrated printed circuit board and test contactor for high speed semiconductor testing having an alignment housing with a cavity for receipt and positioning of the integrated circuit to be tested, a printed circuit board having a non-conductive elastomer portion positioned along a surface of the printed circuit board and an electrically balanced microwave transmission line structure having flexible fingers for transmitting test signals from the integrated circuit through the printed circuit board. A U-shaped ground element extends around the microwave transmission line structure.

Abstract: An integrated printed circuit board and test contactor for high speed semiconductor testing having an alignment housing with a cavity for receipt and positioning of the integrated circuit to be tested, a printed circuit board having a non-conductive elastomer portion positioned along a surface of the printed circuit board and an electrically balanced microwave transmission line structure having flexible fingers for transmitting test signals from the integrated circuit through the printed circuit board. A U-shaped ground element extends around the microwave transmission line structure.