Abstract: An apparatus and method for manufacturing a micro-electrical mechanical system (MEMS) package comprising a first molded body having a first acoustic port, a second molded body connected to the first molded body, a leadframe at least partially integral with at least one of the first and second molded bodies, a die cavity provided on at least one of the first and second molded bodies and having a second acoustic port, a MEMS die provided on the die cavity, a channel connecting the first and second acoustic ports, the first molded body sealing at least a portion of the channel, and a lid attached to the second molded body and sealing at least a portion of the die cavity.

Abstract: A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.

Abstract: A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.

Abstract: A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.

Abstract: A method of making a packaged electrical device comprises the steps of (a) connecting one end of a wire to a first point (e.g., a first electrical node) in the package, and (b) connecting the other end of the wire to a second point (e.g., a second electrical node) in the package, characterized by (c) causing energy from an external source to heat at least one predetermined segment of the wire to a temperature that is below its melting point (MP) but not below its recrystallization temperature (RCT), and (d) cooling the heated segment to a temperature below its RCT [e.g., to room temperature (RT)], thereby to increase the stiffness modulus of the segment. In one embodiment, the external source is a laser whose optical output is absorbed by the segment. In another embodiment, the heated segment is rapidly cooled (i.e., quenched) to RT.

Abstract: A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.

Abstract: Packages for electronic devices are formed from a die such as a silicon die in electrical communication with a substrate through a mating array, e.g. ball array, on the substrate. An underfill material is present between the die and substrate in the region of the array. For large dies (a dimension of 15 mm or greater) failure of the connection between the die and substrate is avoided by employing a particle filled underfill material with specifically chosen Young moduli both below and above the glass transition temperature of the underfill material.