Patents by Inventor Jason P. Weiand

Jason P. Weiand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Intermediate member with protrusions for medical device battery assemblies
    Patent number: 12011606
    Abstract: In some examples, a battery assembly for an implantable medical device. The assembly includes a housing, an electrode stack comprising a plurality of electrode plates disposed inside the housing, and an intermediate member configured to align the electrode stack at a fixed position within the housing, the intermediate member comprising a plurality of side walls, and at least one protrusion disposed on an exterior surface of the side walls, wherein the at least one protrusion is in thermal contact with an interior surface of the housing.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: June 18, 2024
    Assignee: Medtronic, Inc.
    Inventors: Jeffrey J. Louwagie, Joseph J. Viavattine, Richard W. Swenson, Jason P. Weiand
  • BATTERY ASSEMBLY FOR MEDICAL DEVICE
    Publication number: 20210196961
    Abstract: In some examples, a battery assembly for an implantable medical device. The assembly includes a housing, an electrode stack comprising a plurality of electrode plates disposed inside the housing, and an intermediate member configured to align the electrode stack at a fixed position within the housing, the intermediate member comprising a plurality of side walls, and at least one protrusion disposed on an exterior surface of the side walls, wherein the at least one protrusion is in thermal contact with an interior surface of the housing.
    Type: Application
    Filed: November 13, 2020
    Publication date: July 1, 2021
    Inventors: Jeffrey J. Louwagie, Joseph J. Viavattine, Richard W. Swenson, Jason P. Weiand
  • Implantable medical device header
    Patent number: 9345185
    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: May 17, 2016
    Assignee: Medtronic, Inc.
    Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
  • Implantable medical device header
    Patent number: 8989872
    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: March 24, 2015
    Assignee: Medtronic, Inc.
    Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
  • IMPLANTABLE MEDICAL DEVICE HEADER
    Publication number: 20140133123
    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.
    Type: Application
    Filed: November 14, 2012
    Publication date: May 15, 2014
    Applicant: MEDTRONIC, INC.
    Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand
  • IMPLANTABLE MEDICAL DEVICE HEADER
    Publication number: 20140135882
    Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.
    Type: Application
    Filed: November 14, 2012
    Publication date: May 15, 2014
    Applicant: MEDTRONIC, INC.
    Inventors: Jeevan M. Prasannakumar, Christopher M. Haenisch, David Bates, John C. Olson, George Patras, Yanzhu Zhao, Jason P. Weiand