Patents by Inventor Jason Paul Gill

Jason Paul Gill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and structure for determining thermal cycle reliability
    Patent number: 9287186
    Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.
    Type: Grant
    Filed: May 28, 2008
    Date of Patent: March 15, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Ronald Gene Filippi, Jason Paul Gill, Vincent J. McGahay, Paul Stephen McLaughlin, Conal Eugene Murray, Hazara Singh Rathore, Thomas M. Shaw, Ping-Chuan Wang
  • METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY
    Publication number: 20080224135
    Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.
    Type: Application
    Filed: May 28, 2008
    Publication date: September 18, 2008
    Inventors: Ronald Gene Filippi, Jason Paul Gill, Vincent J. McGahay, Paul Stephen McLaughlin, Hazara Singh Rathore, Thomas M. Shaw, Ping-Chuan Wang, Conal Eugene Murray
  • Structure for determining thermal cycle reliability
    Patent number: 7388224
    Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.
    Type: Grant
    Filed: August 10, 2006
    Date of Patent: June 17, 2008
    Assignee: International Business Machines Corporation
    Inventors: Ronald Gene Filippi, Jason Paul Gill, Vincent J. McGahay, Paul Stephen McLaughlin, Conal Eugene Murray, Hazara Singh Rathore, Thomas M. Shaw, Ping-Chuan Wang
  • Method and structure for determining thermal cycle reliability
    Patent number: 7098054
    Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: August 29, 2006
    Assignee: International Business Machines Corporation
    Inventors: Ronald Gene Filippi, Jason Paul Gill, Vincent J. McGahay, Paul Stephen McLaughlin, Conal Eugene Murray, Hazara Singh Rathore, Thomas M. Shaw, Ping-Chuan Wang