Patents by Inventor Jason Paul Goodelle

Jason Paul Goodelle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for packaging electronic devices using thin bonding regions
    Patent number: 6890445
    Abstract: In the method, a cap wafer surface is lithographically etched at time of fabrication, so that a raised ridge onto which bonding material is placed is formed near a perimeter of a desired cavity region. This is done in order to reduce the bonding area between the cap wafer and electronic device wafers, so as to provide a better defined standoff. In another aspect of the method, the cap wager surface is lithographically etched to form recesses or trenches near the perimeter of a cavity region, each recess being filled with a sealing material, and polished if necessary to be flush with the cap wafer surface. Thereafter, the cap wafer surface is etched so that the filled recesses become the raised ridges which are used to bond a cap wafer to an electronic device wafer.
    Type: Grant
    Filed: December 13, 2001
    Date of Patent: May 10, 2005
    Assignee: Agere Systems, Inc.
    Inventors: Bradley Paul Barber, LaRue Norman Dunkleberger, Jason Paul Goodelle, Thomas Herbert Shilling
  • Process for packaging electronic devices using thin bonding regions
    Publication number: 20030111437
    Abstract: In the method, a cap wafer surface is lithographically etched at time of fabrication, so that a raised ridge onto which bonding material is placed is formed near a perimeter of a desired cavity region. This is done in order to reduce the bonding area between the cap wafer and electronic device wafers, so as to provide a better defined standoff. In another aspect of the method, the cap wager surface is lithographically etched to form recesses or trenches near the perimeter of a cavity region, each recess being filled with a sealing material, and polished if necessary to be flush with the cap wafer surface. Thereafter, the cap wafer surface is etched so that the filled recesses become the raised ridges which are used to bond a cap wafer to an electronic device wafer.
    Type: Application
    Filed: December 13, 2001
    Publication date: June 19, 2003
    Inventors: Bradley Paul Barber, LaRue Norman Dunkleberger, Jason Paul Goodelle, Thomas Herbert Shilling