Patents by Inventor Jason Price

Jason Price has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
    Publication number: 20020077045
    Abstract: A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.
    Type: Application
    Filed: December 20, 2001
    Publication date: June 20, 2002
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Gerard S. Maloney, Jason Price, Scott Chin, Jiro Kajiwara, Malek Charif
  • Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
    Patent number: 6368189
    Abstract: A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the wafer at a peripheral edge. The resilient pneumatic annular sealing bladder defines a second pneumatic zone radially interior to the first pneumatic zone and extends between the first surface of the wafer stop plate and the wafer when the wafer is attached to the polishing head during a polishing operation and is coupled for fluid communication to a second pressurized pneumatic fluid. The wafer attachment stop plate is operative during non polishing periods to prevent the wafer from flexing excessively from an applied vacuum force used to hold the wafer to the polishing head during wafer loading and unloading operations.
    Type: Grant
    Filed: September 3, 1999
    Date of Patent: April 9, 2002
    Assignee: Mitsubishi Materials Corporation
    Inventors: Gerard S. Maloney, Jason Price, Scott Chin, Jiro Kajiwara, Malek Charif