Abstract: An imaging device is provided that may be used for visually inspecting structures. In one embodiment, the imaging device includes an image capture device; and a rail system having a stationary component connected to the image capture device and a sliding component for movement along a horizontal axis. The system can further include a jig structure engaged to the sliding component of the rail system. The jig structure may include a first mount location for engagement to a first type connector and a second mount location for engagement to a second type connector. The jig structure is engaged to the sliding component to position the housing so that the first and second mount locations are in line and parallel to a direction of travel along the horizontal axis including a point at which the first and second mount locations pass through the imaging location.

Abstract: A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.

Abstract: An apparatus includes a motherboard with a processor socket, a load frame connected to the motherboard adjacent to at least two sides of the processor socket, and a processor retainer rotatably connected to the load frame, the processor retainer being positionable in a closed position, an opened position, and an installation position. The processor retainer extends over the processor socket when the processor retainer is in the closed position.

Abstract: An apparatus includes a motherboard with a processor socket, a load frame connected to the motherboard adjacent to at least two sides of the processor socket, and a processor retainer rotatably connected to the load frame, the processor retainer being positionable in a closed position, an opened position, and an installation position. The processor retainer extends over the processor socket when the processor retainer is in the closed position.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.

Abstract: Methods and structures are provided for implementing selective airflow modification. An airflow control member holder receives and retains an airflow control member having compliance characteristics allowing easy removal and changing of the airflow control member. The airflow control member holder includes retention features to facilitate mounting and removal from the system, such as mounting and removal from a printed circuit board (PCB). The airflow control member holder provides a protective function for a component, such as a depopulated component, a central processing unit (CPU) or other device.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: An Off The Module (OTM) cable assembly includes a back shell assembly and a guide block, where the guide block is disposed on a top surface of a electronic package. The back shell assembly is disposed inside a cavity of the guide block, where the back shell assembly includes a plurality of cable subassemblies and a back shell holder. Each cable subassembly from the plurality of cable subassemblies includes a compression connector portion and a cable portion, where the cable portion is mechanically coupled and electrically coupled to the compression connector portion. A contact wire and a contact spring of each cable subassembly is compressed against a respective plated contact pad on the top surface of the electronic package, where the compressed contact wire and the compressed contact spring of each cable subassembly is electrical coupled to the electronic package via the respective plated contact pad.

Abstract: An Off The Module (OTM) cable assembly includes a back shell assembly and a guide block, where the guide block is disposed on a top surface of a electronic package. The back shell assembly is disposed inside a cavity of the guide block, where the back shell assembly includes a plurality of cable subassemblies and a back shell holder. Each cable subassembly from the plurality of cable subassemblies includes a compression connector portion and a cable portion, where the cable portion is mechanically coupled and electrically coupled to the compression connector portion. A contact wire and a contact spring of each cable subassembly is compressed against a respective plated contact pad on the top surface of the electronic package, where the compressed contact wire and the compressed contact spring of each cable subassembly is electrical coupled to the electronic package via the respective plated contact pad.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: An apparatus, multi-layer semiconductor substrate and system for testing a high-speed signal through a printed circuit board is provided. Embodiment of the present invention provides an apparatus comprises a multi-layer substrate, one or more transmission lines disposed within the multi-layer substrate, one or more connectors attached to the multi-layer substrate for connecting one or more test cards, a lid, comprising one or more cutouts for the one or more connectors, a clamp for compressing the multi-layer substrate against the lid, and one or more high-speed connectors attached to the one or more test cards, respectively.

Abstract: Methods and structures are provided for implementing selective airflow modification. An airflow control member holder receives and retains an airflow control member having compliance characteristics allowing easy removal and changing of the airflow control member. The airflow control member holder includes retention features to facilitate mounting and removal from the system, such as mounting and removal from a printed circuit board (PCB). The airflow control member holder provides a protective function for a component, such as a depopulated component, a central processing unit (CPU) or other device.

Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Abstract: An apparatus, multi-layer semiconductor substrate and system for testing a high-speed signal through a printed circuit board is provided. Embodiment of the present invention provides an apparatus comprises a multi-layer substrate, one or more transmission lines disposed within the multi-layer substrate, one or more connectors attached to the multi-layer substrate for connecting one or more test cards, a lid, comprising one or more cutouts for the one or more connectors, a clamp for compressing the multi-layer substrate against the lid, and one or more high-speed connectors attached to the one or more test cards, respectively.

Abstract: An externally threaded fastener is captivated by a component that includes an opening. The externally threaded fastener includes a thread and a non-threaded shaft. The opening includes a major diameter and a minor diameter. The minor diameter includes a first diameter portion, a second diameter portion, and orthogonal portions that connect the first diameter portion and the second diameter portion. To captivate the externally threaded fastener with the component, the externally threaded fastener is positioned within the component opening and the externally threaded fastener is angled relative to an axis of symmetry of the opening in order to engage the threads of the externally threaded fastener with the component opening until the non-threaded shaft is fixed against at least two planes of the component by the first diameter portion of the minor diameter.

Abstract: A module placement apparatus is provided and includes alignment brackets and a module placement tool. The alignment brackets include first guidance features, define an interior and are disposable aside an array of contacts. The module placement tool is insertible into the interior in first and second stages and includes a frame, a module gripping element operably supported on the frame, second guidance features engageable with the first guidance features at a conclusion of the first stage to maintain a relative orientation of the array of contacts and the frame during the second stage, and a gimbaled handle coupled to the module gripping element to maintain the relative orientation during the first stage until at least first and second guidance feature engagement.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: An externally threaded fastener is captivated by a component that includes an opening. The externally threaded fastener includes a thread and a non-threaded shaft. The opening includes a major diameter and a minor diameter. The minor diameter includes a first diameter portion, a second diameter portion, and orthogonal portions that connect the first diameter portion and the second diameter portion. To captivate the externally threaded fastener with the component, the externally threaded fastener is positioned within the component opening and the externally threaded fastener is angled relative to an axis of symmetry of the opening in order to engage the threads of the externally threaded fastener with the component opening until the non-threaded shaft is fixed against at least two planes of the component by the first diameter portion of the minor diameter.