Abstract: Signal bridging using an unpopulated processor interconnect, including: communicatively coupling an apparatus to a plurality of first signal paths between a bootstrap processor (BSP) and a processor interconnect of a circuit board; communicatively coupling the apparatus to a plurality of second signal paths between the processor interconnect and a peripheral interface of the circuit board; and communicatively coupling the BSP to the peripheral interface via one or more third signal paths in the apparatus.

Abstract: Signal bridging using an unpopulated processor interconnect, including: communicatively coupling an apparatus to a plurality of first signal paths between a bootstrap processor (BSP) and a processor interconnect of a circuit board; communicatively coupling the apparatus to a plurality of second signal paths between the processor interconnect and a peripheral interface of the circuit board; and communicatively coupling the BSP to the peripheral interface via one or more third signal paths in the apparatus.

Abstract: Signal bridging using an unpopulated processor interconnect, including: communicatively coupling an apparatus to a plurality of first signal paths between a bootstrap processor (BSP) and a processor interconnect of a circuit board; communicatively coupling the apparatus to a plurality of second signal paths between the processor interconnect and a peripheral interface of the circuit board; and communicatively coupling the BSP to the peripheral interface via one or more third signal paths in the apparatus.

Abstract: An apparatus includes a printed circuit board including a connector footprint comprising a first footprint portion operative to receive a first connector portion and a second footprint portion operative to receive a second connector portion. The first footprint portion is compliant with a first communications link type and the first and second footprint portions are jointly compliant with a second communications link type. The printed circuit board includes first conductive traces coupled to the first footprint portion and a first device footprint. The first conductive traces are selectively configurable according to a selected one of the first and second communications link types. The printed circuit board includes a second conductive traces coupled to the second footprint portion and the first device footprint. in at least one embodiment of the apparatus, the first communications link type is AC-coupled and the second communications link type is DC-coupled.

Abstract: An apparatus includes a printed circuit board including a connector footprint comprising a first footprint portion operative to receive a first connector portion and a second footprint portion operative to receive a second connector portion. The first footprint portion is compliant with a first communications link type and the first and second footprint portions are jointly compliant with a second communications link type. The printed circuit board includes first conductive traces coupled to the first footprint portion and a first device footprint. The first conductive traces are selectively configurable according to a selected one of the first and second communications link types. The printed circuit board includes a second conductive traces coupled to the second footprint portion and the first device footprint. in at least one embodiment of the apparatus, the first communications link type is AC-coupled and the second communications link type is DC-coupled.

Abstract: An apparatus includes a printed circuit board including a connector footprint comprising a first footprint portion operative to receive a first connector portion and a second footprint portion operative to receive a second connector portion. The first footprint portion is compliant with a first communications link type and the first and second footprint portions are jointly compliant with a second communications link type. The printed circuit board includes first conductive traces coupled to the first footprint portion and a first device footprint. The first conductive traces are selectively configurable according to a selected one of the first and second communications link types. The printed circuit board includes a second conductive traces coupled to the second footprint portion and the first device footprint. In at least one embodiment of the apparatus, the first communications link type is AC-coupled and the second communications link type is DC-coupled.

Abstract: An apparatus includes a printed circuit board including a connector footprint comprising a first footprint portion operative to receive a first connector portion and a second footprint portion operative to receive a second connector portion. The first footprint portion is compliant with a first communications link type and the first and second footprint portions are jointly compliant with a second communications link type. The printed circuit board includes first conductive traces coupled to the first footprint portion and a first device footprint. The first conductive traces are selectively configurable according to a selected one of the first and second communications link types. The printed circuit board includes a second conductive traces coupled to the second footprint portion and the first device footprint. In at least one embodiment of the apparatus, the first communications link type is AC-coupled and the second communications link type is DC-coupled.