Patents by Inventor Jason Reese

Jason Reese has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating method
    Publication number: 20060182881
    Abstract: Methods of improving the adhesion of metal layers to a substrate, such as an optical substrate, are provided. Such methods employ a layer of an adhesion promoting composition including a plating catalyst on the substrate before metal deposition. Also provided are devices made by such processes.
    Type: Application
    Filed: February 15, 2006
    Publication date: August 17, 2006
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Joseph Montano, Jason Reese, Luke Little
  • Printed circuit board manufacture
    Publication number: 20050112369
    Abstract: Methods of enhancing the adhesion between a metal surface and an organic polymeric material, such as a dielectric material, in the manufacture of printed circuit boards are provided. Such methods use an adhesion promoting composition including polymeric particles disposed between the metal surface and the organic polymeric material. Also provided are printed circuit boards having enhanced adhesion between a metal surface and an organic polymeric material.
    Type: Application
    Filed: September 29, 2004
    Publication date: May 26, 2005
    Applicant: Rohm and Haas Electronic Materials, L.L.C.
    Inventors: Scott Ibbitson, Joseph Montano, Jason Reese, Robert Sloan