Abstract: Thermosetting adhesives for use in e.g., particleboard or fiberboard, wherein the adhesives comprise a resin having azetidinium functional groups, can provide fast tack-building and curing, as well as ultimately excellent bonding characteristics. Preferably, the azetidinium-functional resin is formed from the reaction product of a polyamidoamine and epichlorohydrin.

Abstract: Thermosetting adhesive compositions for use in e.g., particleboard or fiberboard, wherein the compositions comprise a blend of a protein-based component and a polymeric quaternary amine cure accelerant, can provide the fast tack-building and curing, as well as ultimately good bonding characteristics normally associated with synthetic resin compositions. Preferably, the polymeric quaternary amine cure accelerant is the reaction product of a polyamidoamine and epichlorohydrin.

Abstract: Termosetting adhesives for use in e.g., particleboard or fiberboard, wherein the adhesives comprise a resin having azetidinium functional groups, can provide fast tack-building and curing, as well as ultimately excellent bonding characteristics. Preferably, the azetidinium-functional resin is formed from the reaction product of a polyamidoamine and epichlorohydrin.

Abstract: An adhesive binder composition containing a urea-formaldehyde resin modified with a modified soy protein, and the use of the binder for preparing wood composites, especially particleboard.

Abstract: An adhesive binder composition containing an isocyanate-functional resin modified with a protein, preferably with a source of soy protein, and the use of the binder for preparing wood composites, especially OSB.

Abstract: Thermosetting adhesive compositions for use in e.g., particleboard or fiberboard, wherein the compositions comprise a blend of a protein-based component and a polymeric quaternary amine cure accelerant, can provide the fast tack-building and curing, as well as ultimately good bonding characteristics normally associated with synthetic resin compositions. Preferably, the polymeric quaternary amine cure accelerant is the reaction product of a polyamidoamine and epichlorohydrin.

Abstract: Thermosetting adhesive compositions for use in e.g., particleboard or fiberboard, wherein the compositions comprise a blend of a protein-based component and a polymeric quaternary amine cure accelerant, can provide the fast tack-building and curing, as well as ultimately good bonding characteristics normally associated with synthetic resin compositions. Preferably, the polymeric quaternary amine cure accelerant is the reaction product of a polyamidoamine and epichlorohydrin.

Abstract: An adhesive binder composition containing a urea-formaldehyde resin modified with a protein, preferably with a source of soy protein and the use of the binder for preparing wood composites, especially particleboard.

Abstract: An aqueous binder composition containing a urea-formaldehyde resin modified with a protein, preferably with a source of soy protein and the use of the binder for preparing fiber mats, especially glass fiber mats.

Abstract: Disclosed is a spectrometer system with unique wavelength resolution improving relative positioning of diffraction grating and detector. Also disclosed is a modified evolving windowed factor analysis based method of detecting semiconductor etch end points which is particularly well suited for use in real time monitoring and process control. Use of wavelength group selecting mask filters is also disclosed.

Abstract: A process for forming a semiconductor device includes placing a substrate (104) into an apparatus (300), creating a plasma, and processing the substrate (104). The apparatus (300) includes an electromagnetic source (120), a bulk material (302), and a first barrier layer (304). The bulk material (302) is between the electromagnetic source (120) and an interior (126) of the apparatus (300). The first barrier layer (304) is between the bulk material (302) and the interior (126). A process for operating an apparatus (300) includes forming a polymer layer along an inorganic layer (302, 306or 702), wherein the polymer layer is formed within the apparatus (300); removing the polymer layer to expose the inorganic layer (302, 306, or 702); and etching at least a portion of the exposed inorganic layer (302, 306, or 702). Typically, the inorganic layer (203, 306, or 702) is semiconductive or resistive.

Abstract: Fractional-volatilization separation systems and methods are disclosed which enable a stable, continuous, non-bubbling liquid flow, essentially constant surface area/volume ratio, temperature controlled, fractional volatilization of volatile/semi-volatile components in a liquid analyte or component containing sample. The fractional volatilization separator system can be utilized in small scale analytical and large scale chemical purification, concentration and desalinization applications. Continuous rapid removal of residual liquid sample can provide concentrated non-volatile component/analyte solution, and allows quick and easy washout between sequential use with different liquid samples.