Abstract: The present invention includes one or more nanopores in a SixNy membrane comprising a monoprotic surface termination, methods of making, and methods of using the one or more nanopores, where the one or more nanopores are a chemically-tuned controlled dielectric breakdown (CT-CDB) nanopore membrane, wherein the CT-CDB allows for long-term stability of measurements in the presence of only electrolyte (open pore current stability) and ability to support many molecular detection events. In addition, the CT-CBD has pore that unclog spontaneously, in response to voltage cessation or application, or both.

Abstract: The present invention provides a simple method for ablating a protective thin film on a bulk surface and roughening the underlying bulk. In an embodiment, silicon nitride thin films, which are useful as etch-stop masks in micro- and nano-fabrication, is removed from a silicon wafer's surface using a hand-held “flameless” Tesla-coil lighter. Vias created by a spatially localized electron beam from the lighter allow a practitioner to perform micro- and nano-fabrication without the conventional steps of needing a photoresist and photolithography. Patterning could be achieved with a hard mask or rastering of the spatially confined discharge, offering—with low barriers to rapid use—particular capabilities that might otherwise be out of reach to researchers without access to conventional, instrumentation-intensive micro- and nano-fabrication workflows.

Abstract: The present invention includes one or more nanopores in a SixNy membrane comprising a monoprotic surface termination, methods of making, and methods of using the one or more nanopores, where the one or more nanopores are a chemically-tuned controlled dielectric breakdown (CT-CDB) nanopore membrane, wherein the CT-CDB allows for long-term stability of measurements in the presence of only electrolyte (open pore current stability) and ability to support many molecular detection events. In addition, the CT-CBD has pore that unclog spontaneously, in response to voltage cessation or application, or both.

Abstract: The present invention provides a simple method for ablating a protective thin film on a bulk surface and roughening the underlying bulk. In an embodiment, silicon nitride thin films, which are useful as etch-stop masks in micro- and nano-fabrication, is removed from a silicon wafer's surface using a hand-held “flameless” Tesla-coil lighter. Vias created by a spatially localized electron beam from the lighter allow a practitioner to perform micro- and nano-fabrication without the conventional steps of needing a photoresist and photolithography. Patterning could be achieved with a hard mask or rastering of the spatially confined discharge, offering—with low barriers to rapid use—particular capabilities that might otherwise be out of reach to researchers without access to conventional, instrumentation-intensive micro- and nano-fabrication workflows.

Abstract: A method is disclosed for electroless plating of thin metal film directly onto a substrate. The method includes the steps of: cleaning the substrate to remove organic material; etching a surface of the substrate to remove an oxygen-containing surface layer; soaking and rinsing the substrate in a plurality of baths following etching; and electroless plating the metal onto the substrate.

Abstract: A method is disclosed for electroless plating of thin metal film directly onto a substrate. The method includes the steps of: cleaning the substrate to remove organic material; etching a surface of the substrate to remove an oxygen-containing surface layer; soaking and rinsing the substrate in a plurality of baths following etching; and electroless plating the metal onto the substrate.