Abstract: Disclosed are wire assemblies for solar cells. One wire assembly includes a first polymer film and a second polymer film overlaying the first polymer film. The second polymer film has a wire embedded in it such that a surface of the wire that is facing away from the first polymer film is exposed. The gauge of the wire is about 36 to 46 gauge. The thickness of the second polymer film is about ¼ to ½ the diameter of the wire and about 0.5 to 1.5 mils.

Abstract: Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.

Abstract: Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.

Abstract: Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.

Abstract: Provided are electrical routing structures for installing on buildings and for interconnecting adjacent rows of building integrable photovoltaic (BIPV) modules at the ends of these rows. The electrical routing structures may be also used for sealing interfaces with other building components, such as asphalt shingles. An electrical routing structure may include a base, top flap, side flap, and one or two connectors. After the structure is installed, the base is aligned with photovoltaic portions of BIPV modules in one row and bridges a gap between photovoltaic portions of BIPV modules in two adjacent rows. The connectors may be used to interconnect BIPV modules positioned at the ends of two adjacent rows.

Abstract: A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.

Abstract: Provided are electrical routing structures for installing on buildings and for interconnecting adjacent rows of building integrable photovoltaic (BIPV) modules at the ends of these rows. The electrical routing structures may be also used for sealing interfaces with other building components, such as asphalt shingles. An electrical routing structure may include a base, top flap, side flap, and one or two connectors. After the structure is installed, the base is aligned with photovoltaic portions of BIPV modules in one row and bridges a gap between photovoltaic portions of BIPV modules in two adjacent rows. The connectors may be used to interconnect BIPV modules positioned at the ends of two adjacent rows.

Abstract: Provided are multi-module inverters and/or converters for connecting to a set of building integrable photovoltaic (BIPV) modules that are interconnected in series and arranged into photovoltaic arrays on building structures. Outputs from multiple multi-module inverters and/or converters in one array may be combined using parallel connections and then connected to an electrical grid, standalone electrical network, or central inverter. Each set is connected to a different multi-module inverter and/or converter and may have a variable number of BIPV modules. A multi-module inverter and/or converter may be positioned within or integrated into one of the BIPV modules or attached to a building structure supporting the array. In certain embodiments, a multi-module inverter and/or converter is installed in a ventilation channel on the back side of a module. A multi-module inverter and/or converter may be also integrated into an electrical routing structure connected to one of the BIPV modules.

Abstract: Disclosed are wire assemblies for solar cells. One wire assembly includes a first polymer film and a second polymer film overlaying the first polymer film. The second polymer film has a wire embedded in it such that a surface of the wire that is facing away from the first polymer film is exposed. The gauge of the wire is about 36 to 46 gauge. The thickness of the second polymer film is about ¼ to ½ the diameter of the wire and about 0.5 to 1.5 mils.

Abstract: A power-loss-inhibiting current-collector. The power-loss-inhibiting current-collector includes a trace for collecting current from a solar cell. The power-loss-inhibiting current-collector further includes a current-limiting portion of the power-loss-inhibiting current-collector. The current-limiting portion of the power-loss-inhibiting current-collector is coupled to the trace. The current-limiting portion of the power-loss-inhibiting current-collector is configured to regulate current flow through the power-loss-inhibiting current-collector.

Abstract: A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.