Abstract: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An electronic device may include an infrared light source and an infrared image sensor to enable infrared beacon functionality. In a location sharing scenario, a first electronic device may use the infrared light source to emit infrared light and serve as an infrared beacon. A second electronic device may use the infrared image sensor to detect the infrared beacon and identify the location of the first electronic device. The infrared image sensor that is used to detect the infrared beacon may also serve as a time-of-flight sensor for a light detection and ranging (LiDAR) module. The second electronic device (that detects the infrared beacon) may provide output such as visual, audio, and/or haptic output to inform a user of the location of the infrared beacon.

Abstract: Input devices can employ ultrasonic touch sensing capabilities that allow user inputs to be detected through conductive materials, such as metal enclosures. The ultrasonic touch sensing can include generation of ultrasound signals with a piezoelectric layer. The ultrasound signals can be reflected when a user or other object is in contact with a housing, and the reflected signal can be detected by the same piezoelectric layer that produced the ultrasound signal. Such a piezoelectric layer can include a piezoelectric polymer, such as polyvinylidene fluoride (PVDF). An array of electrodes distributed on opposing sides of the use of electric layer can be operated to generate ultrasound signals and detect reflected signals. Such an input device can be operated in conjunction with a conductive (e.g.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: An acoustic imaging system coupled to an acoustic imaging medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic imaging medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: Ultrasonic force detection systems and methods can be based on propagation of ultrasonic waves in a user's body (e.g., in a user's digit). An amount of force can be determined using time-of-flight (TOF) techniques of one or more ultrasonic waves propagating in the user's body. In some examples, an electronic device including a transducer can be coupled to a digit, and can transmit ultrasonic waves into the digit. As the wave propagates through the thickness of the digit, a reflection of at least a portion of the transmitted wave can occur due to the bone and/or due to reaching the opposite side of the digit (e.g., finger pad). One or more reflections can be measured to determine the amount of force.

Abstract: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: Ultrasonic force detection systems and methods can be based on propagation of ultrasonic waves in a user's body (e.g., in a user's digit). An amount of force can be determined using time-of-flight (TOF) techniques of one or more ultrasonic waves propagating in the user's body. In some examples, an electronic device including a transducer can be coupled to a digit, and can transmit ultrasonic waves into the digit. As the wave propagates through the thickness of the digit, a reflection of at least a portion of the transmitted wave can occur due to the bone and/or due to reaching the opposite side of the digit (e.g., finger pad). One or more reflections can be measured to determine the amount of force.

Abstract: Apparatus and method for selectively applying a voltage to one major surface of a pair of piezoelectric motors (PZTs) on a disk drive head suspension with a primary plane of a load beam of the head suspension parallel to the major surfaces of the PZT elements electrically insulated from the load beam. Electrical connections to the PZTs are made via wires, solder, conductive epoxy or electro-mechanical attachment of a plated surface of the PZT with a bond pad on an electrically isolated substrate. Lead extensions or separate pieces may be used to connect to the PZTs. The PZTs may be located on a major surface of the load beam, or may be assembled in a pre-fabricated motor assembly before being installed in the head suspension. Apertures in the load beam and other layers permit physical installation of the PZT motors and enable electrical connection to the PZTs.

Abstract: Apparatus and method for selectively applying a voltage to one major surface of a pair of piezoelectric motors (PZTs) on a disk drive head suspension with a primary plane of a load beam of the head suspension parallel to the major surfaces of the PZT elements electrically insulated from the load beam. Electrical connections to the PZTs are made via wires, solder, conductive epoxy or electro-mechanical attachment of a plated surface of the PZT with a bond pad on an electrically isolated substrate. Lead extensions or separate pieces may be used to connect to the PZTs. The PZTs may be located on a major surface of the load beam, or may be assembled in a pre-fabricated motor assembly before being installed in the head suspension. Apertures in the load beam and other layers permit physical installation of the PZT motors and enable electrical connection to the PZTs.

Abstract: A head suspension having an active crosstalk attenuation conductor is formed on a load beam for conducting a crosstalk attenuation signal in order to reduce crosstalk interference between first and second conductors on the load beam. Preferably, the active crosstalk attenuation conductor is located in between the first and second conductors along a portion of the load beam and the crosstalk attenuation signal is a function of the first signal so that the electromagnetic field generated by the active crosstalk attenuation conductor reduces or cancels, at the second conductor, the electromagnetic field generated by the first conductor.