Patents by Inventor Jason S. Miller

Jason S. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220343780
    Abstract: A method including displaying, in a graphical user interface (GUI) of a computer, a map of a plurality of airport taxiways. The method also includes receiving a start point on the map. The method also includes receiving an endpoint on the map. The method also includes generating, automatically, a path for an aircraft to take to navigate the plurality of taxiways from the start point to the endpoint. The method also includes superimposing the path on the map in the GUI.
    Type: Application
    Filed: April 21, 2022
    Publication date: October 27, 2022
    Applicant: The Boeing Company
    Inventors: Jason S. Miller, Kristian I. Thaulow, Matthew G. Croydon, Donald Jones, Grant Macklem, Garrett Moore
  • Patent number: 9421410
    Abstract: An exercise device comprising an elongated member having a handle at a first end and weight-affixing unit at a second end. The weight-affixing unit may be adjusted longitudinally. Multiple interchangeable handles provide means for conducting various different exercises which target different forearm muscles. The exercise device allows a user to exercise muscles in their forearms which have long been difficult to isolate. One method of using the exercise device comprises a user, while seated, (i) resting his or her forearm on his or her thigh such that the wrist rests on the knee while the hand extends therefrom while gripping the handle of the exercise device with the weight-affixing unit off of the ground; and (ii) lifting and lowering with the wrist repeatedly the weights using said handle.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: August 23, 2016
    Inventor: Jason S. Miller
  • Patent number: 7880739
    Abstract: A system and method for simulating to one or more individual observers a view through a window using a display screen comprising a storage device containing in electronic form one or more images of a scene selected from the group consisting of one or more images of the scene at different angles and one or more images of the scene at different magnifications. A display screen is adapted to display the images to one or more individual observers, and a sensor is adapted to locate observers with respect to the display screen. A controller is adapted to select one or more of the images based on angle or distance of the individual observers with respect to the display screen and display the selected images on the display screen to simulate to the observers a view through a window of the scene.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: February 1, 2011
    Assignee: International Business Machines Corporation
    Inventors: David C Long, Jason S Miller
  • Patent number: 7687894
    Abstract: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: March 30, 2010
    Assignee: International Business Machines Corporation
    Inventors: John S. Corbin, Jr., David L. Edwards, David C. Long, Jason S. Miller
  • Patent number: 7436057
    Abstract: An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: October 14, 2008
    Assignee: International Business Machines Corporation
    Inventors: David C. Long, William L. Brodsky, Jason S. Miller, John G. Torok, Jeffrey A. Zitz
  • Publication number: 20080232072
    Abstract: A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.
    Type: Application
    Filed: June 2, 2008
    Publication date: September 25, 2008
    Inventors: David L. Edwards, Ronald L. Hering, David C. Long, Jason S. Miller, Carl R. Peterson
  • Patent number: 7394666
    Abstract: A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained.
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: July 1, 2008
    Assignees: International Business Machines Corporation, Apple Computer, Inc.
    Inventors: David L. Edwards, Ronald L. Hering, David C. Long, Jason S. Miller, Carl R. Peterson
  • Publication number: 20080088624
    Abstract: A system and method for simulating to one or more individual observers a view through a window using a display screen comprising a storage device containing in electronic form one or more images of a scene selected from the group consisting of one or more images of the scene at different angles and one or more images of the scene at different magnifications. A display screen is adapted to display the images to one or more individual observers, and a sensor is adapted to locate observers with respect to the display screen. A controller is adapted to select one or more of the images based on angle or distance of the individual observers with respect to the display screen and display the selected images on the display screen to simulate to the observers a view through a window of the scene.
    Type: Application
    Filed: October 11, 2006
    Publication date: April 17, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: DAVID C. LONG, JASON S. MILLER
  • Patent number: 7350423
    Abstract: A dispensing system for feeding paste through a screen onto a workpiece monitors the position of a piston applying pressure to the paste with a linear variable differential transformer and sets limits on the slope of the piston displacement is a measure of the feed rate and the “spring back” of the piston when pressure is released, as a measure of trapped air in the system.
    Type: Grant
    Filed: January 14, 2004
    Date of Patent: April 1, 2008
    Assignee: International Business Machines Corporation
    Inventors: David C. Long, Jason S. Miller
  • Publication number: 20080073765
    Abstract: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.
    Type: Application
    Filed: September 27, 2006
    Publication date: March 27, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John S. Corbin, David L. Edwards, David C. Long, Jason S. Miller
  • Patent number: 7239516
    Abstract: A flexible plate for securing a microchip surface to the surface of a cooling device. The flexible plate allows for z-directional movement between the microchip subassembly having a circuit board and a semiconductor substrate, and the cooling device. The flexible plate is a compact, single piece design that provides constraints in alignment in the x-, y-, and theta-directions, while allowing for z-direction compliance and tilt compliance. The flexible plate has tabs for mounting the microchip subassembly and tabs for mounting the cooling device. The microchip tabs are opposite one another and the cooling device mounting tabs are opposite one another. The flexible plate is a one-piece construction made from sheet metal, plastic, or metal castings. The flexible plate has a band with all the tabs mounted on the inside of the band, or one set of tabs mounted on the outside of the band.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: July 3, 2007
    Assignee: International Business Machines Corporation
    Inventors: David C. Long, Glenn G. Daves, David L. Edwards, Ronald L. Hering, Sushumna Iruvanti, Kenneth C. Marston, Jason S. Miller
  • Patent number: 7118385
    Abstract: A self-aligning socket for an integrated circuit package includes an outer frame and an array of contacts configured for alignment with corresponding conductive pads on the bottom of the integrated circuit package. The outer frame further includes a first plurality of alignment ball bearings configured thereon, the ball bearings mounted on cantilevered spring rods.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: October 10, 2006
    Assignee: International Business Machines Corporation
    Inventors: Paul Bodenweber, David C. Long, Jason S. Miller, Robert P. Westerfield, Jr., Yuet-Ying Yu
  • Patent number: 7107901
    Abstract: A method and apparatus for the rapid cooling of screen masks used in the fabrication of semiconductor components is provided. The method and apparatus use a specially designed cooling plate which is contacted with a mask frame holding the screening mask. After a heated cleaning step which cleans the mask frame and screening mask of metal paste used in the screening operation, the cooling plate having one or more concave lower surfaces contacts the upper surfaces of the mask frame and bends the mask frame in the shape of the concave surfaces. This ensures intimate contact between the cooling plate and mask frame and enhances the thermal efficiency of the cooling step.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: September 19, 2006
    Assignee: International Business Machines Corporation
    Inventors: Raschid J Bezama, William W Harkins, David C Long, Jason S Miller, Christopher E Pepe, Ronald M Rothkranz, John A Rudy, Benjamin P Tongue
  • Patent number: 7086896
    Abstract: An expanding standoff connector is disclosed including a collar having a slit through a wall of the collar, a tapered interior surface and an exterior surface configured to engage an interior of a mounting opening of the circuit board. A fastener including a threaded portion and a substantially cone shaped portion configured to mate with the tapered interior surface of the collar is placed within the collar and advanced to expand the collar to mount the circuit board. A related method for mounting a circuit board is also disclosed. Since the expansion is horizontal only (purely radial), a more uniform radial expansion from top-to-bottom of the collar is applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be maintained.
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: August 8, 2006
    Assignee: International Business Machines Corporation
    Inventors: David L. Edwards, Ronald L. Hering, David C. Long, Jason S. Miller
  • Patent number: 7045011
    Abstract: An integrated circuit screen printing nozzle that has a nozzle body, a first inner layer on the nozzle body, a second outer layer on the first layer, and an opening through the nozzle body, the first layer, and the second layer. The first and second layers can be an insert held within the body. The opening allows paste material to flow through the screen printing nozzle to the stencil mask. Also, the second outer layer includes a contact surface adapted to contact the stencil mask. One feature of the invention is that the first layer is softer (has a lower durometer) than the second layer. This allows the second layer to be more durable than the first layer and for the first layer to provide additional flexibility to the second layer. Therefore, the invention provides a nozzle that has the high durability characteristics of a hard outer surface with the compliance of a soft nozzle.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: May 16, 2006
    Assignee: International Business Machines Corporation
    Inventors: David C. Long, Jason S. Miller, Randall J. Werner