Abstract: A shutter disk suitable for shield a substrate support in a physical vapor deposition chamber is provided. In one embodiment, the shutter disk includes a disk-shaped body having an outer diameter disposed between a top surface and a bottom surface. The disk-shape body includes a double step connecting the bottom surface to the outer diameter.

Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.

Abstract: A shutter disk suitable for shield a substrate support in a physical vapor deposition chamber is provided. In one embodiment, the shutter disk includes a disk-shaped body having an outer diameter disposed between a top surface and a bottom surface. The disk-shape body includes a double step connecting the bottom surface to the outer diameter.

Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.

Abstract: A manufacturing system includes a gantry module, having an end effector, for moving workpieces from a conveyor system to a working area, such as a swap module. The swap module removes a matrix of processed workpieces from a load lock and place a matrix of unprocessed workpieces in its place. The processed workpieces are then moved by the gantry module back to the conveyor. Due to the speed of operation, the end effector may build up excessive electrostatic charge. To remove this built up charge, grounded electrically-conductive brushes are strategically positioned so that, as the end effector moves during normal operation, it comes in contact with these brushes. This removes this built up charge on the end effector, without affecting throughput. In another embodiment, the end effector moves over the brushes while the swap module is moving matrix to and from the load lock.

Abstract: A manufacturing system includes a gantry module, having an end effector, for moving workpieces from a conveyor system to a working area, such as a swap module. The swap module removes a matrix of processed workpieces from a load lock and place a matrix of unprocessed workpieces in its place. The processed workpieces are then moved by the gantry module back to the conveyor. Due to the speed of operation, the end effector may build up excessive electrostatic charge. To remove this built up charge, grounded electrically-conductive brushes are strategically positioned so that, as the end effector moves during normal operation, it comes in contact with these brushes. This removes this built up charge on the end effector, without affecting throughput. In another embodiment, the end effector moves over the brushes while the swap module is moving matrix to and from the load lock.

Abstract: A manufacturing system includes a gantry module, having an end effector, for moving workpieces from a conveyor system to a working area, such as a swap module. The swap module removes a matrix of processed workpieces from a load lock and place a matrix of unprocessed workpieces in its place. The processed workpieces are then moved by the gantry module back to the conveyor. Due to the speed of operation, the end effector may build up excessive electrostatic charge. To remove this built up charge, grounded electrically-conductive brushes are strategically positioned so that, as the end effector moves during normal operation, it comes in contact with these brushes. This removes this built up charge on the end effector, without affecting throughput. In another embodiment, the end effector moves over the brushes while the swap module is moving matrix to and from the load lock.

Abstract: The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to the transfer chamber. The mainframe further comprises a shutter disk shelf configured to store one or more shutter disks to be used by the one or more processing chambers, wherein the shutter disk shelf is accessible to the substrate transferring robot so that the substrate transferring robot can transfer the one or more shutter disks between the shutter disk shelf and the one or more processing chambers directly or indirectly connected to the transfer chamber.

Abstract: A rotary end effector for use for the high speed handling of workpieces, such as solar cells, is disclosed. The rotary end effector is capable of infinite rotation. The rotary end effector has a gripper bracket, capable of supporting a plurality of grippers, arranged in any configuration, such as a 4×1 linear array. Each gripper is in communication with a suction system, wherein, in some embodiments, each gripper can be selectively enabled and disabled. Provisions are also made to allow electrical components, such as proximity sensors, to be mounted on the rotating gripper bracket. In another embodiment, an end effector with multiple surfaces, each with a plurality of grippers, is used.

Abstract: A gripper system which utilizes two different suction systems is disclosed. This gripper system utilizes one suction system to pick up an item, while using the second suction system to hold the item. In some embodiments, a Venturi device based suction system is used as the first suction system to pick up the item, as this type of system is proficient at picking up items without requiring initial contact to create a seal. In some embodiments, a vacuum based system is used as the second suction system, as this type of system is able to hold items cost effectively.

Abstract: A gripper system which utilizes two different suction systems is disclosed. This gripper system utilizes one suction system to pick up an item, while using the second suction system to hold the item. In some embodiments, a Venturi device based suction system is used as the first suction system to pick up the item, as this type of system is proficient at picking up items without requiring initial contact to create a seal. In some embodiments, a vacuum based system is used as the second suction system, as this type of system is able to hold items cost effectively.

Abstract: A manufacturing system includes a gantry module, having an end effector, for moving workpieces from a conveyor system to a working area, such as a swap module. The swap module removes a matrix of processed workpieces from a load lock and place a matrix of unprocessed workpieces in its place. The processed workpieces are then moved by the gantry module back to the conveyor. Due to the speed of operation, the end effector may build up excessive electrostatic charge. To remove this built up charge, grounded electrically-conductive brushes are strategically positioned so that, as the end effector moves during normal operation, it comes in contact with these brushes. This removes this built up charge on the end effector, without affecting throughput. In another embodiment, the end effector moves over the brushes while the swap module is moving matrix to and from the load lock.

Abstract: A rotary end effector for use for the high speed handling of workpieces, such as solar cells, is disclosed. The rotary end effector is capable of infinite rotation. The rotary end effector has a gripper bracket, capable of supporting a plurality of grippers, arranged in any configuration, such as a 4×1 linear array. Each gripper is in communication with a suction system, wherein, in some embodiments, each gripper can be selectively enabled and disabled. Provisions are also made to allow electrical components, such as proximity sensors, to be mounted on the rotating gripper bracket. In another embodiment, an end effector with multiple surfaces, each with a plurality of grippers, is used.

Abstract: A gripper system which utilizes two different suction systems is disclosed. This gripper system utilizes one suction system to pick up an item, while using the second suction system to hold the item. In some embodiments, a Venturi device based suction system is used as the first suction system to pick up the item, as this type of system is proficient at picking up items without requiring initial contact to create a seal. In some embodiments, a vacuum based system is used as the second suction system, as this type of system is able to hold items cost effectively.

Abstract: A system and method are disclosed for controlling an ion beam. A deceleration lens is disclosed for use in an ion implanter. The lens may include a suppression electrode, first and second focus electrodes, and first and second shields. The shields may be positioned between upper and lower portions of the suppression electrode. The first and second shields are positioned between the first focus electrode and an end station of the ion implanter. Thus positioned, the first and second shields protect support surfaces of said first and second focus electrodes from deposition of back-streaming particles generated from said ion beam. In some embodiments, the first and second focus electrodes may be adjustable to enable the electrode surfaces to be adjusted with respect to a direction of the ion beam. By adjusting the angle of the focus electrodes, parallelism of the ion beam can be controlled. Other embodiments are described and claimed.

Abstract: A system and method for receiving unprocessed workpieces, moving them, orienting them and placing them in a load lock, or other end point is disclosed. The system includes a gantry module for moving workpieces from a conveyor system to a swap module. The swap module is used to remove a carrier or matrix of processed workpieces from a load lock and place a carrier of matrix of unprocessed workpieces in its place. The processed workpieces are then moved by the gantry module back to the conveyor. The gantry module may have X, Y, Z and rotational actuators and include an end effector having multiple grippers. A method of aligning a plurality of workpieces on the end effector so that the plurality can be transported at the same time is also disclosed.

Abstract: The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to the transfer chamber. The mainframe further comprises a shutter disk shelf configured to store one or more shutter disks to be used by the one or more processing chambers, wherein the shutter disk shelf is accessible to the substrate transferring robot so that the substrate transferring robot can transfer the one or more shutter disks between the shutter disk shelf and the one or more processing chambers directly or indirectly connected to the transfer chamber.

Abstract: A system and method are disclosed for controlling an ion beam. A deceleration lens is disclosed for use in an ion implanter. The lens may include a suppression electrode, first and second focus electrodes, and first and second shields. The shields may be positioned between upper and lower portions of the suppression electrode. The first and second shields are positioned between the first focus electrode and an end station of the ion implanter. Thus positioned, the first and second shields protect support surfaces of said first and second focus electrodes from deposition of back-streaming particles generated from said ion beam. In some embodiments, the first and second focus electrodes may be adjustable to enable the electrode surfaces to be adjusted with respect to a direction of the ion beam. By adjusting the angle of the focus electrodes, parallelism of the ion beam can be controlled. Other embodiments are described and claimed.

Abstract: A shutter disk suitable for shield a substrate support in a physical vapor deposition chamber is provided. In one embodiment, the shutter disk includes a disk-shaped body having an outer diameter disposed between a top surface and a bottom surface. The disk-shape body includes a double step connecting the bottom surface to the outer diameter.

Abstract: The present invention relates to a cluster tool for processing semiconductor substrates. One embodiment of the present invention provides a mainframe for a cluster tool comprising a transfer chamber having a substrate transferring robot disposed therein. The substrate transferring robot is configured to shuttle substrates among one or more processing chambers directly or indirectly connected to the transfer chamber. The mainframe further comprises a shutter disk shelf configured to store one or more shutter disks to be used by the one or more processing chambers, wherein the shutter disk shelf is accessible to the substrate transferring robot so that the substrate transferring robot can transfer the one or more shutter disks between the shutter disk shelf and the one or more processing chambers directly or indirectly connected to the transfer chamber.