Patents by Inventor Jason Schipp

Jason Schipp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Catalyst ink for three-dimensional conductive constructs
    Patent number: 10883005
    Abstract: A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: January 5, 2021
    Assignee: Science Applications International Corporation
    Inventors: David Morris, John Timler, Jason Schipp
  • Catalyst Ink for Three-Dimensional Conductive Constructs
    Publication number: 20200399482
    Abstract: A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.
    Type: Application
    Filed: March 19, 2020
    Publication date: December 24, 2020
    Inventors: David Morris, John Timler, Jason Schipp
  • Catalyst ink for three-dimensional conductive constructs
    Patent number: 10619059
    Abstract: A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 14, 2020
    Assignee: Science Applications International Corporation
    Inventors: David Morris, John Timler, Jason Schipp