Abstract: The present invention relates to atom probe data and associated systems and methods. Aspects of the invention are directed toward a computing system configured to predict a characteristic associated with an atom probe specimen that includes a data set receiving component configured to receive a three-dimensional data set associated with a portion of the specimen. The system further includes a predicting/calculating component configured to predict the characteristic associated with the specimen based on the data set. Other aspects of the invention are directed toward a method for evaluating a manufacturing process using atom probe data that includes receiving a three-dimensional data set associated with a portion of a microelectronic assembly produced by a manufacturing process. The method further includes determining a variation between the data set and a configuration expected to result from the manufacturing process.

Abstract: The present invention relates to atom probe data processes and associated systems. Aspects of the invention are directed toward a computing system configured to process atom probe data that includes a data set receiving component configured to receive a first three-dimensional data set. The first three-dimensional data set has a first data element structure and is based on data collected from performing an atom probe process on a portion of an atom probe specimen. The system further includes a data set constructing component configured to create a second three-dimensional data set having a second data element structure different than the first data element structure. In selected embodiments, the system can further include a Fourier Transform component configured to perform a Fourier Transform on a portion of the second three-dimensional data set.

Abstract: A probe tip of a scanning probe microscope or a profilometer is scanned across a surface in a contact, non-contact, or intermittent contact mode to sense the presence of a feature to be located. The probe tip may be scanned along substantially parallel paths, spiral paths or in a sequence of random positions to locate the feature. After the feature has been located, a different searching sequence is employed in order to locate a center of the feature if such is desired. Then, the probe tip is scanned across the surface over the center of the feature in order to perform a measurement of the feature. For some particular features such as tungsten plugs, metal clusters or metal filled via holes of a surface, an electrical or magnetic parameter of the feature may be used for locating the feature after which the same or a different characteristic of the feature, such as geometric profile, can be measured.