Abstract: A waterproof method for an electronic device and a waterproof electronic device are provided. The electronic device comprises a printed circuit board, which comprises a board, a plurality of electrical elements and a button device. The waterproof method comprises the following steps: applying a first non-solid adhesive to cover the button device directly, curing the first non-solid adhesive to form a first waterproof layer, applying a second non-solid adhesive to at least cover the electrical elements directly and curing the second non-solid adhesive to form a second waterproof layer. In the end, assembling the printed circuit board, sealed with the waterproof layers, into a case to form the waterproof electronic device.

Abstract: An electrical device is provided. The electrical device comprises a circuit board and a waterproof layer. The waterproof layer substantially seals at least one portion of the circuit board to prevent the short circuit after water infiltrating. Thereby, this particular structure provides superior waterproof protection for the electrical device. This electrical device may be installed in a band structure which facilitates portability. Moreover, the present invention further provides methods for sealing at least one portion of the electrical device or the circuit board hermetically, while the electrical device or the circuit board would be sealed with the waterproof layer hermetically.