Patents by Inventor Jason Sieck

Jason Sieck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240082073
    Abstract: Absorbent articles (30) have bonded materials and bond patterns. One of the absorbent articles (30) has a bond pattern (150a-150d) comprising bonds (151,153,155,155a-155d). The bond pattern (150a-150d) comprises a longitudinally extending series of bonds (151,153), which comprises a first bond (151) and a second bond (153) disposed longitudinally adjacent to the first bond (151). The first bond (151) has an inboard lateral edge (158), an outboard lateral edge (156), a top edge (152), and a bottom edge (154) having a recess portion (164). The second bond (153) has an inboard lateral edge (158) and an outboard lateral edge (156), a top edge (152) having a recess portion (164), and a bottom edge (154).
    Type: Application
    Filed: February 23, 2021
    Publication date: March 14, 2024
    Inventors: Jongmin Mun, Ning Ye, Xixi Miao, Qi Dai, Xiaomin Liu, Weizhi Guo, Jason Sieck