Abstract: A solar-cell module. The solar-cell module includes a plurality of solar cells that are electrically coupled together. The solar-cell module further includes an in-laminate-diode assembly electrically coupled with the plurality of solar cells. The in-laminate-diode assembly is configured to prevent power loss. The solar-cell module also includes a protective structure at least partially encapsulating the plurality of solar cells. In addition, the solar-cell module includes a plurality of external-connection mechanisms mounted to a respective plurality of edge regions of the protective structure. An external-connection mechanism of the plurality of external-connection mechanisms is configured to enable collection of current from the plurality of solar cells and to allow interconnection with at least one other external device.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: A method for smoothing the surface of a metallic substrate. The method includes providing a metallic substrate and smoothing a surface of the metallic substrate by irradiating the surface with a high-intensity energy source, such that the surface is smoothed to remove defects from the surface by creating an altered surface layer. The altered surface layer is configured to receive at least one layer in a fabrication process of an electronic device.