Patents by Inventor Jason Stephen Corneille
Jason Stephen Corneille has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10541544Abstract: Techniques and systems are described that enable multiple current source prioritization with overvoltage protection.Type: GrantFiled: May 14, 2019Date of Patent: January 21, 2020Assignee: MIASOLÉ HI-TECH CORP.Inventors: Hyung Paek, Jia-Jay Bill Liu, Thomas Aquinas Heckel, Nicholai Busch, Uriel Rosas Rivera, James Teixeira, Nicolas Guerrero, Jason Stephen Corneille, Richard Weinberg
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Publication number: 20200014329Abstract: Disclosed are module connectors for flexible photovoltaic modules. A module connector may include a clamp and an insert configured to be inserted into the clamp. The insert may have an insert body, an electrical lead and an electrical connector. The clamp may have a body portion with a recess configured to receive the insert body, a first clamping portion configured to clamp a second portion of the electrical connector to connect it to the body portion, and a second clamping portion with a first clamping surface configured to contact a first sheet of the module and a second clamping surface configured to contact a second sheet of the module. The second clamping portion may be configured to connect the clamp to the module such that the clamp overlaps and extends around a part of the first sheet, a part of the module's exterior edge surface, and a part of the second sheet.Type: ApplicationFiled: September 17, 2019Publication date: January 9, 2020Inventors: Jason Stephen Corneille, Nicholai Busch, Richard Weinberg, John Huang
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Publication number: 20190296166Abstract: Provided herein are ultra-thin flexible photovoltaic modules. The flexible modules meet UL and IEC safety requirements without needing one or more encapsulant layers. The no-encapsulant design reduces material usage and associated cost and eliminates thermal and mechanical stress imparted by the encapsulant. In some embodiments, a flexible module includes photovoltaic cells enclosed between sealing sheets, wires partially embedded in wire carriers and disposed such that the wires interconnect the photovoltaic cells. The wire carriers include multiple polymeric layers. Adhesive from module components such as sealing sheets and wire carriers bonds the components together.Type: ApplicationFiled: March 23, 2018Publication date: September 26, 2019Inventors: John Huang, Jason Stephen Corneille, Feng Xie, Richard Weinberg
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Patent number: 10425035Abstract: Disclosed are module connectors for flexible photovoltaic modules. A module connector may include a clamp and an insert configured to be inserted into the clamp. The insert may have an insert body, an electrical lead and an electrical connector. The clamp may have a body portion with a recess configured to receive the insert body, a first clamping portion configured to clamp a second portion of the electrical connector to connect it to the body portion, and a second clamping portion with a first clamping surface configured to contact a first sheet of the module and a second clamping surface configured to contact a second sheet of the module. The second clamping portion may be configured to connect the clamp to the module such that the clamp overlaps and extends around a part of the first sheet, a part of the module's exterior edge surface, and a part of the second sheet.Type: GrantFiled: September 15, 2017Date of Patent: September 24, 2019Assignee: Miasolé Hi-Tech Corp.Inventors: Jason Stephen Corneille, Nicholai Busch, Richard Weinberg, John Huang
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Publication number: 20190267819Abstract: Techniques and systems are described that enable multiple current source prioritization with overvoltage protection.Type: ApplicationFiled: May 14, 2019Publication date: August 29, 2019Inventors: Hyung Paek, Jia-Jay Bill Liu, Thomas Aquinas Heckel, Nicholai Busch, Uriel Rosas Rivera, James Teixeira, Nicolas Guerrero, Jason Stephen Corneille, Richard Weinberg
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Patent number: 10389298Abstract: Techniques and systems are described that enable multiple current source prioritization with overvoltage protection.Type: GrantFiled: October 20, 2017Date of Patent: August 20, 2019Assignee: Miasole Hi-Tech Corp.Inventors: Hyung Paek, Jia-Jay Liu, Thomas Aquinas Heckel, Nicholai Busch, Uriel Rosas Rivera, James Teixeira, Nicolas Guerrero, Jason Stephen Corneille, Richard Weinberg
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Publication number: 20190165189Abstract: Disclosed are flexible photovoltaic modules that have photovoltaic cells electrically connected to each other and positioned in a sealed space between flexible top and bottom sheets and that includes a first region at a first end of the module, a second region at a second end of the module, and a central region interposed between the first and second regions that encompasses at least 75% of the cells, and a bus bar with interlaced copper strands, an external insulation, a length of at least 1 meter and a thickness of about 0.5 millimeters or less, a conductivity that can conduct at least 3.0 amps of current, that extends substantially the length of the module, is positioned in the first region, the central region, and the second region, and is electrically connected, in the first region, to a second external electrical connector, and, in the second region, to the cells.Type: ApplicationFiled: November 29, 2017Publication date: May 30, 2019Inventors: Jason Stephen Corneille, James Teixeira
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Publication number: 20190089294Abstract: Disclosed are module connectors for flexible photovoltaic modules. A module connector may include a clamp and an insert configured to be inserted into the clamp. The insert may have an insert body, an electrical lead and an electrical connector. The clamp may have a body portion with a recess configured to receive the insert body, a first clamping portion configured to clamp a second portion of the electrical connector to connect it to the body portion, and a second clamping portion with a first clamping surface configured to contact a first sheet of the module and a second clamping surface configured to contact a second sheet of the module. The second clamping portion may be configured to connect the clamp to the module such that the clamp overlaps and extends around a part of the first sheet, a part of the module's exterior edge surface, and a part of the second sheet.Type: ApplicationFiled: September 15, 2017Publication date: March 21, 2019Inventors: Jason Stephen Corneille, Nicholai Busch, Richard Weinberg, John Huang
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Publication number: 20190081593Abstract: Techniques and systems are described that enable multiple current source prioritization with overvoltage protection.Type: ApplicationFiled: October 20, 2017Publication date: March 14, 2019Inventors: Hyung Paek, Jia-Jay Liu, Thomas Aquinas Heckel, Nicholai Busch, Uriel Rosas Rivera, James Teixeira, Nicolas Guerrero, Jason Stephen Corneille, Richard Weinberg
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Patent number: 10158031Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.Type: GrantFiled: November 12, 2014Date of Patent: December 18, 2018Assignee: Beijing Apollo Ding Rong Solar Technology Co., LTD.Inventors: Mulugeta Zerfu Wudu, Jason Stephen Corneille, Steven Thomas Croft, Steven Douglas Flanders, William James McColl
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Publication number: 20180331244Abstract: Disclosed are wire assemblies for solar cells. One wire assembly includes a first polymer film and a second polymer film overlaying the first polymer film. The second polymer film has a wire embedded in it such that a surface of the wire that is facing away from the first polymer film is exposed. The gauge of the wire is about 36 to 46 gauge. The thickness of the second polymer film is about ¼ to ½ the diameter of the wire and about 0.5 to 1.5 mils.Type: ApplicationFiled: May 4, 2018Publication date: November 15, 2018Inventors: Jason Stephen Corneille, Anil Vijayendran, Todd A. Krajewski
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Publication number: 20180323322Abstract: Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.Type: ApplicationFiled: March 29, 2018Publication date: November 8, 2018Inventors: Jason Stephen Corneille, Michael C. Meyers, Adam C. Sherman, Nazir Ahmad
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Publication number: 20170288078Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.Type: ApplicationFiled: March 29, 2017Publication date: October 5, 2017Inventors: Mulugeta Zerfu Wudu, Jason Stephen Corneille, Steven Thomas Croft, Steven Douglas Flanders, William James McColl
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Patent number: 9620660Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.Type: GrantFiled: March 26, 2013Date of Patent: April 11, 2017Assignee: Beijing Apollo Ding Rong Solar Technology Co., Ltd.Inventors: Mulugeta Zerfu Wudu, Jason Stephen Corneille, Steven Thomas Croft, Steven Douglas Flanders, William James McColl
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Publication number: 20150136199Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.Type: ApplicationFiled: November 12, 2014Publication date: May 21, 2015Inventors: Mulugeta Zerfu Wudu, Jason Stephen Corneille, Steven Thomas Croft, Steven Douglas Flanders, William James McColl
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Patent number: 9018513Abstract: A solar-cell module. The solar-cell module includes a plurality of solar cells that are electrically coupled together. The solar-cell module further includes an in-laminate-diode assembly electrically coupled with the plurality of solar cells. The in-laminate-diode assembly is configured to prevent power loss. The solar-cell module also includes a protective structure at least partially encapsulating the plurality of solar cells. In addition, the solar-cell module includes a plurality of external-connection mechanisms mounted to a respective plurality of edge regions of the protective structure. An external-connection mechanism of the plurality of external-connection mechanisms is configured to enable collection of current from the plurality of solar cells and to allow interconnection with at least one other external device.Type: GrantFiled: April 11, 2011Date of Patent: April 28, 2015Assignee: Apollo Precision (Kunming) Yuanhong LimitedInventors: Steven Thomas Croft, William James McColl, Shawn Everson, Jason Stephen Corneille, Kent Whitfield, Todd Krajewski, Darin Britwhistle
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Patent number: 8912429Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.Type: GrantFiled: March 20, 2008Date of Patent: December 16, 2014Assignee: Hanergy Holding Group Ltd.Inventors: Mulugeta Zerfu Wudu, Jason Stephen Corneille, Steven Thomas Croft, Steven Douglas Flanders, William James McColl
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Patent number: 8586398Abstract: Provided herein are methods of incorporating additives into thin-film solar cell substrates and back contacts. In certain embodiments, sodium is incorporated into a substrate or a back contact of a thin-film photovoltaic stack where it can diffuse into a CIGS or other absorber layer to improve efficiency and/or growth of the layer. The methods involve laser treating the substrate or back contact in the presence of a sodium (or sodium-containing) solid or vapor to thereby incorporate sodium into the surface of the substrate or back contact. In certain embodiments, the surface is simultaneously smoothed.Type: GrantFiled: June 22, 2010Date of Patent: November 19, 2013Assignee: MiasoleInventors: Dallas W. Meyer, Jason Stephen Corneille, Steven Thomas Croft, Mulugeta Zerfu Wudu, William James McColl
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Publication number: 20130276855Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.Type: ApplicationFiled: March 26, 2013Publication date: October 24, 2013Inventors: Mulugeta Zerfu Wudu, Jason Stephen Corneille, Steven Thomas Croft, Steven Douglas Flanders, William James McColl
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Patent number: 8546172Abstract: Provided herein are methods of polishing, cleaning and texturing back contacts of thin-film solar cells. According to various embodiments, the methods involve irradiating sites on the back contact with laser beams to remove contaminants and/or smooth the surface of the back contact. The back contact, e.g., a molybdenum, copper, or niobium thin-film, is smoothed prior to deposition of the absorber and other thin-films of the photovoltaic stack. In certain embodiments, laser polishing of the back contact is used to enhance the diffusion barrier characteristics of the back contact layer, with all or a surface layer of the back contact becoming essentially amorphous. In certain embodiments, the adhesion of the absorber layer is enhanced by the textured back contact and by the presence of the amorphous metal at the deposition surface.Type: GrantFiled: June 22, 2010Date of Patent: October 1, 2013Assignee: MiasoleInventors: Dallas W. Meyer, Jason Stephen Corneille, Steven Thomas Croft, Mulugeta Zerfu Wudu, William James McColl