Abstract: The subject technology is directed to systems and methods for power delivery in semiconductor devices. According to an embodiment, the subject technology provides a semiconductor device including a substrate comprising a first side and a second side. A first connection is coupled to the first side and a grid is coupled to the second side. The semiconductor device further comprises a first via coupled to the first connection and the grid, the first via is configured to transmit electrical power between the first side and the second side. In some implementations, the first via may be configured to improve the uniformity of power delivery and distribution, allowing for optimal circuit design and thermal effects. There are other embodiments as well.

Abstract: The subject technology is directed to systems and methods for enhancing die-to-die connectivity in semiconductor devices. According to an embodiment, the subject technology provides a device that includes a first layer comprising a first block and a second layer comprising a second block. The device further includes a third layer coupled to and positioned between the first and second layers. The first and second layers are aligned at a first region of the first connection, based on a set of design strategies. Embodiments of the subject technology enable automated and efficient routing of signals across dice, accommodating multiple instantiations of circuit blocks with various orientations. This ensures minimal signal path length and high-density interconnects by minimizing the physical footprint of connections and adhering to stringent design rule checks within a 3D integrated circuit layout. There are other embodiments as well.

Abstract: A floor planning tool is provided that performs the functions that are typically performed by floor planning tools, but in addition, determines the supply of routing resources and the demand on routing resources for all routing channels while applying variable routing rules and static timing estimations to arrive at a preliminary routed floor plan. This drastically reduces the number of iterations that subsequently will need to be performed by the floor planning tool and by routing and static timing analysis tools to arrive at a final routed floor plan.

Abstract: A floor planning tool is provided that performs the functions that are typically performed by floor planning tools, but in addition, determines the supply of routing resources and the demand on routing resources for all routing channels while applying variable routing rules and static timing estimations to arrive at a preliminary routed floor plan. This drastically reduces the number of iterations that subsequently will need to be performed by the floor planning tool and by routing and static timing analysis tools to arrive at a final routed floor plan.

Abstract: A computer system performs a verification process that quickly and efficiently determines a temperature rise of DC conductor lines of an IC design caused by Joule heating in nearby AC conductor lines of the IC design, and whether the temperature rise is acceptable in terms of an electromigration performance of the IC design.

Abstract: A computer system performs a verification process that quickly and efficiently determines a temperature rise of DC conductor lines of an IC design caused by Joule heating in nearby AC conductor lines of the IC design, and whether the temperature rise is acceptable in terms of an electromigration performance of the IC design.

Abstract: Differences between block interfaces of a partitioned logic block in two floorplans of an integrated circuit can be determined by comparing an image of pins of a partitioned logic block in a first floorplan of the integrated circuit with an image of pins of the partitioned logic block in a second floorplan of the integrated circuit. The second floorplan can represent a new floorplan design resulting from a change to an integrated circuit design represented by the first floorplan. If no differences exist between pins of the partitioned logic block in the first and second floorplans, information representing the partitioned logic block in the second floorplan can be substituted with information representing the partitioned logic block in the first floorplan.

Abstract: A method and system of identifying one or more nets in a digital IC design that are at risk of electromigration comprises selecting a manufacturing process for the digital IC design and obtaining a clock period and process voltage. A voltage waveform transition time and effective capacitance is calculated for one or more of the nets. A maximum allowable effective capacitance for each one of the nets is calculated based upon a peak current analysis or an RMS current analysis. The effective capacitance for each net is compared against the maximum allowable capacitance to identify those nets that are at risk of failure due to the effects of electromigration.

Abstract: A method and system of identifying one or more nets in a digital IC design that are at risk of electromigration comprises selecting a manufacturing process for the digital IC design and obtaining a clock period and process voltage. A voltage waveform transition time and effective capacitance is calculated for one or more of the nets. A maximum allowable effective capacitance for each one of the nets is calculated based upon a peak current analysis or an RMS current analysis. The effective capacitance for each net is compared against the maximum allowable capacitance to identify those nets that are at risk of failure due to the effects of electromigration.