Patents by Inventor Jason Thomas Chiota

Jason Thomas Chiota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250230293
    Abstract: The thermally stable aliphatic polyketone composition comprises an aliphatic polyketone, a metal deactivator, a scavenger and at least one antioxidant. The thermally stable aliphatic polyketone composition can be used in connector assembly including but not limited to a backshell application.
    Type: Application
    Filed: January 16, 2024
    Publication date: July 17, 2025
    Applicant: TE Connectivity Solutions GmbH
    Inventors: Shruti DESHMUKH, Jason Thomas CHIOTA, Lei WANG, Hyo Chang YUN
  • Publication number: 20250232892
    Abstract: A method of assembling an electrical component is provided. The method includes providing a dielectric body configured to support an electrical conductor. The dielectric body includes a polymer resin. The dielectric body includes glass filler elements embedded in the polymer resin, and the dielectric body includes gas cells embedded in the polymer resin.
    Type: Application
    Filed: January 11, 2024
    Publication date: July 17, 2025
    Inventors: Shruti Deshmukh, Jason Thomas Chiota, David Patrick Orris
  • Publication number: 20240339789
    Abstract: An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is adjusted to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.
    Type: Application
    Filed: April 5, 2023
    Publication date: October 10, 2024
    Applicant: TE Connectivity Solutions GmbH
    Inventors: Chad William MORGAN, Bruce Allen CHAMPION, David Patrick ORRIS, Jessica H B. HEMOND, Megan Hoarfrost BEERS, Aakriti KHAREL, Jason Thomas CHIOTA
  • Patent number: 10179434
    Abstract: Molding assemblies and molding processes are disclosed. The molding assemblies are for producing a product and include a first subassembly and a second subassembly for the producing of the product. The first subassembly includes a cavity insert arrangement corresponding with the design of the product, a movable insert abutting the cavity insert arrangement, and rail members securing the movable insert with interlocking features at a specific location, the specific location being one of multiple movable insert positions. The molding process includes molding a first product with the movable insert and the additional movable insert being positioned at a first movable insert portion, removing the subassembly from the second subassembly, re-positioning the movable insert and the additional movable insert to a second movable insert position, and molding a second product with the movable insert and the additional movable insert being positioned at the second movable insert portion.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: January 15, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Jason Anthony Osborne, Fernando Luis Sierra, Jason Thomas Chiota
  • Publication number: 20180085983
    Abstract: Molding assemblies and molding processes are disclosed. The molding assemblies are for producing a product and include a first subassembly and a second subassembly for the producing of the product. The first subassembly includes a cavity insert arrangement corresponding with the design of the product, a movable insert abutting the cavity insert arrangement, and rail members securing the movable insert with interlocking features at a specific location, the specific location being one of multiple movable insert positions. The molding process includes molding a first product with the movable insert and the additional movable insert being positioned at a first movable insert portion, removing the subassembly from the second subassembly, re-positioning the movable insert and the additional movable insert to a second movable insert position, and molding a second product with the movable insert and the additional movable insert being positioned at the second movable insert portion.
    Type: Application
    Filed: September 29, 2016
    Publication date: March 29, 2018
    Inventors: Jason Anthony OSBORNE, Fernando Luis SIERRA, Jason Thomas CHIOTA
  • Patent number: 9810850
    Abstract: A fiber gripper component includes a fiber receiving recess which extends from a first surface of the fiber gripper component toward a second surface of the fiber gripper component. The fiber receiving recess extends from a front face to a rear face. The fiber receiving recess has a fiber receiving surface which is positioned between the first surface and the second surface. A plurality of resilient fiber receiving grooves extend from the fiber receiving surface toward the second surface. The resilient fiber receiving grooves have a width which is less than an outer-diameter dimension of mating optical fibers to provide a press fit of the optical fibers into the resilient fiber receiving grooves. The fiber gripper component is molded with tolerances in the submicron range to maintain part functionality to allow automatable fiber assembly.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: November 7, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Aleksandar Kolev Angelov, Daniel Wesley Flemmens, Michael Fredrick Laub, Jason Thomas Chiota
  • Publication number: 20170059789
    Abstract: A ferrule for optical connectors. The ferrule includes a mating face for mating with a mating ferrule. Fiber receiving openings extend through the mating face. A protrusion surface extends from the mating face. The protrusion surface surrounds the fiber receiving openings, wherein all of the fiber receiving openings extend through the protrusion surface of the mating face. A top surface of the ferrule has an opening, the opening is positioned proximate to the mating face. A fiber positioning member is positioned in the ferrule, the fiber positioning member has channels which cooperate with individual fibers to properly position and retain the fibers in the ferrule. The channels have tapered surfaces which guide the fibers into the channels smoothly without the fiber abutting on the wall of the channels.
    Type: Application
    Filed: August 25, 2016
    Publication date: March 2, 2017
    Inventors: Jason Thomas CHIOTA, Daniel Wesley FLEMMENS, Aleksandar Kolev ANGELOV, Michael Joseph VINO, Craig Warren HORNUNG, Michael Fredrick LAUB, Chad MORGAN, Alan PLOTTS
  • Patent number: 9225136
    Abstract: A method of separating wires from a wire bundle includes positioning a cable with a wire bundle at a wire separating area, positioning a gas nozzle at the wire separating area, and directing gas flow at the wire bundle to separate the wires from the wire bundle. A wire separating system is used to separate wires and including a cable holder having a fixture holding a cable with a wire bundle extending into a wire separating area. The system includes a gas nozzle at the wire separating area that directs gas flow into the wire separating area at the wire bundle. The gas flow separates individual wires from the wire bundle. A wire gripper is provided at the wire separating area. The wire gripper grasps the separated wire from the wire bundle.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: December 29, 2015
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventors: Aleksandar Kolev Angelov, Jason Thomas Chiota, Bicheng Chen
  • Publication number: 20140115855
    Abstract: A method of separating wires from a wire bundle includes positioning a cable with a wire bundle at a wire separating area, positioning a gas nozzle at the wire separating area, and directing gas flow at the wire bundle to separate the wires from the wire bundle. A wire separating system is used to separate wires and including a cable holder having a fixture holding a cable with a wire bundle extending into a wire separating area. The system includes a gas nozzle at the wire separating area that directs gas flow into the wire separating area at the wire bundle. The gas flow separates individual wires from the wire bundle. A wire gripper is provided at the wire separating area. The wire gripper grasps the separated wire from the wire bundle.
    Type: Application
    Filed: October 25, 2012
    Publication date: May 1, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: Aleksandar Kolev Angelov, Jason Thomas Chiota, Bicheng Chen