Abstract: An electronic assembly includes a chassis having electronic module mounting positions, each having an electronic module received therein. A module recess is adjacent a first end of the electronic module and a module roller is adjacent a second end. A sealing retainer is coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with a chassis cooling gas passageway and a module cooling gas passageway. The sealing retainer includes a rigid retainer body having a retainer recess adjacent a first end to receive the module roller when the electronic module is in an inserted position. A retainer roller is received in a module recess and a compressible retainer body is between the rigid retainer body and the chassis.

Abstract: A method of forming a nanodiamond article includes forming a continuous film on a substrate using electrophoretic deposition. The continuous film includes greater than 50% nanodiamond concentration by volume. A nanodiamond article includes a continuous film on a substrate having greater than 50% nanodiamond concentration by volume.

Abstract: A method for making a nanodiamond article includes applying an adhesion promoting layer to a substrate, and electrophoretically depositing a nanodiamond film on the substrate with the adhesion promoting layer thereon in a solution to make the nanodiamond article. The nanodiamond article may include a substrate, a nanodiamond film over the substrate, and the adhesion promoting layer between the substrate and the nanodiamond film.

Abstract: A sealing retainer may be coupled between a chassis and an electronic module. The sealing retainer includes a retainer body to be coupled to the chassis and a first cooling gas passageway that may be aligned with a chassis cooling gas passageway. A gas seal body has a second cooling gas passageway aligned with the first cooling gas passageway and coupled to the retainer body and movable between a retracted position that permits insertion and removal of the electronic module and an extended position that seals against the electronic module.

Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

Abstract: A grilling tool is described herein that has a replaceable tip, and can be used with a variety of other attachments. The grilling tool can be made of a heat-conformable material such that during use grooves are formed in the replaceable tip that correspond to a grilling surface on which it is used. Once the grooves are too deep or the tip is fully used, the tip can be replaced.

Abstract: A method for making a nanodiamond article includes applying an adhesion promoting layer to a substrate, and electrophoretically depositing a nanodiamond film on the substrate with the adhesion promoting layer thereon in a solution to make the nanodiamond article. The nanodiamond article may include a substrate, a nanodiamond film over the substrate, and the adhesion promoting layer between the substrate and the nanodiamond film.

Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

Abstract: In one embodiment, a method includes generating a first visual representation of a location of a railroad station in relation to a railroad track, receiving a request for a first maintenance window, and determining that the first maintenance window is associated with the railroad station. The method further includes determining a first time period and generating a second visual representation of information associated with the railroad station during the first time period. The information includes an indication of a time that a train is scheduled to cross the railroad station during the time period. The information also includes an indication of a time duration for a second maintenance window that has been requested during the time period.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.

Abstract: In one embodiment, a method includes generating a first visual representation of a location of a railroad station in relation to a railroad track, receiving a request for a first maintenance window, and determining that the first maintenance window is associated with the railroad station. The method further includes determining a first time period and generating a second visual representation of information associated with the railroad station during the first time period. The information includes an indication of a time that a train is scheduled to cross the railroad station during the time period. The information also includes an indication of a time duration for a second maintenance window that has been requested during the time period.

Abstract: An electronic assembly includes a chassis having electronic module mounting positions, each having an electronic module received therein. A module recess is adjacent a first end of the electronic module and a module roller is adjacent a second end. A sealing retainer is coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with a chassis cooling gas passageway and a module cooling gas passageway. The sealing retainer includes a rigid retainer body having a retainer recess adjacent a first end to receive the module roller when the electronic module is in an inserted position. A retainer roller is received in a module recess and a compressible retainer body is between the rigid retainer body and the chassis.

Abstract: A sealing retainer may be coupled between a chassis and an electronic module. The sealing retainer includes a retainer body to be coupled to the chassis and a first cooling gas passageway that may be aligned with a chassis cooling gas passageway. A gas seal body has a second cooling gas passageway aligned with the first cooling gas passageway and coupled to the retainer body and movable between a retracted position that permits insertion and removal of the electronic module and an extended position that seals against the electronic module.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.

Abstract: A pipe fitting configured to be coupled to a pipe. The pipe fitting includes a body that is elongate along a central axis that extends in a longitudinal direction. The body includes a shell, a stiffener, and a shell-stiffener. The shell includes a shell inner surface that defines a shell through hole that extends through the shell in the longitudinal direction. The stiffener is positioned within the shell through hole, and the stiffener includes a stiffener outer surface that faces the shell inner surface such that the stiffener outer surface and the shell inner surface cooperate to define a pocket configured to receive the pipe. A shell-stiffener seal member is positioned about the stiffener such that a seal member inner surface is substantially flush against the stiffener outer surface and a seal member outer surface abuts against the shell inner surface.

Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.

Abstract: Food products and systems and methods for their production involve microfiltration (“MF”) of fluid skim to form a MF retentate, combining the MF retentate with cream and subjecting the combination to ultrafiltration (“UF”) to form a UF retentate. Prior to UF, the composition is formed of non-acidified components. Following UF, the UF retentate is acidified and forms a food product including a high solids content. The solids content may be further increased using evaporation. The resulting cheese or cheese base contains a lower whey protein ratio in a fat:casein:whey protein ratio compared to systems and methods that do not employ MF.

Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

Abstract: An electronic device may include a circuit board, a heat generating component carried by the circuit board, a heat sink body, and a heat transfer assembly between the heat generating component and the heat sink body. The heat transfer assembly may include a flexible, heat conductive layer having a first portion in thermal contact with the heat generating component and a second portion in thermal contact with the heat sink body. The first and second portions are thermally coupled, and a compressible layer is between the first and second portions of the flexible, heat conductive layer.

Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.