Patents by Inventor Jason Tseng

Jason Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160114180
    Abstract: An ultrathin microchip structure at least includes a flexible base material. The flexible base material includes an installation surface and a printed surface at an upper surface and a lower surface thereof, respectively. The installation surface is provided with one set or multiple sets of integrated circuits. Each of the integrated circuits at least includes a chip and at least one set of transceiver antenna. One or both of the installation surface and the printed surface of the flexible base material is/are applied with a nanometer film layer having characteristics of being waterproof, dustproof, wear resistant, and penetrable by the RF signal, thereby effectively simplifying the present invention as an ultrathin microchip.
    Type: Application
    Filed: April 8, 2015
    Publication date: April 28, 2016
    Inventors: Jason TSENG, Harry WU, Jing-Wen LIAO, Luca TSENG, Lucy TSENG
  • Patent number: 6422337
    Abstract: An outer marginal edge of a loudspeaker cone is connected to an annular suspension member of laminated structure which supports the loudspeaker cone on a support frame. The annular suspension member includes a layer of cloth and a first layer of flexible plastic foam integrally bonded to the cloth. The first layer of foam has an inner surface in contact with the outer marginal edge, and the cloth covers an outer surface of the first layer of foam opposite to the inner surface. A second layer of foam which is thinner than the first layer of foam is disposed between and bonded integrally to the cloth and the first layer of foam. The suspension member is strong and durable and still exhibits good formability and flexibility.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: July 23, 2002
    Assignee: Deccon International Ltd.
    Inventor: Jason Tseng
  • Patent number: D505670
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: May 31, 2005
    Assignee: Hannspree, Inc.
    Inventors: Holger Hoehn, Jason Tseng
  • Patent number: D519493
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: April 25, 2006
    Assignee: Hannspree, Inc.
    Inventors: Brad Zuege, Jason Tseng
  • Patent number: D496634
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: September 28, 2004
    Assignee: Hannspree, Inc.
    Inventors: Jason Tseng, Carter Wang
  • Patent number: D500028
    Type: Grant
    Filed: February 23, 2004
    Date of Patent: December 21, 2004
    Assignee: Hannspree, Inc.
    Inventors: Holger Hoehn, Jason Tseng