Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. An insert is adhesively fastened to the bottom wall. The insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively fastening an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. The insert is a material selected from an epoxy molding compound and a ceramic material. An ejection head chip is adhesively fastened to the die bond surface of the insert.

Abstract: A fluidic ejection cartridge and protective tape system therefor. The fluidic ejection cartridge includes a cartridge body having a cover closing a first end thereof, an ejection head on a second end thereof, and side walls attached to the first and second ends. The side walls include a first side wall, a second side wall, a third side wall attached to the first and second side walls, and a fourth side wall opposite the third side wall. A first removable tape is attached to a release structure on the first side wall and to the ejection head by a first adhesive, and a second removable tape is attached to a portion of the first removable tape by a second adhesive. The second adhesive has an adhesive strength that is about three times greater than an adhesive strength of the first adhesive.

Abstract: A heater assembly for a vaporizing device, a vaporizing device containing the heater assembly, and a method for vaporizing fluid ejected by an ejection head. The heater assembly for the vaporizing device includes a vapor inlet end and a vapor outlet end, positive and negative electrodes for contact with positive and negative heater terminals on a vaporizing heater, an insulator disposed between the positive and negative electrodes, and a wick disposed between the insulator and the vaporizing heater for dispersion of liquid to be vaporized by the vaporizing heater and for back pressure control of the vaporizing device.

Abstract: A heater assembly for a vaporizing device, a vaporizing device containing the heater assembly, and a method for vaporizing fluid ejected by an ejection head. The heater assembly for the vaporizing device includes a vapor inlet end and a vapor outlet end, positive and negative electrodes for contact with positive and negative heater terminals on a vaporizing heater, an insulator disposed between the positive and negative electrodes, and a wick disposed between the insulator and the vaporizing heater for dispersion of liquid to be vaporized by the vaporizing heater and for back pressure control of the vaporizing device.

Abstract: A packaging label for an inkjet printhead including a first label portion adapted for adhesion to a first surface of the inkjet printhead, and a second label portion adapted for adhesion to a second surface of the inkjet printhead. The second label portion has a forked configuration including a first outer portion, a second outer portion and a central portion disposed between the first and second outer portions and adapted for adhesion to a packaging tape adhered to a nozzle plate of the inkjet printhead. The adhesion between the second label portion and the second surface of the inkjet printhead is higher than the adhesion between the first label portion and the first surface of the inkjet printhead.

Abstract: A consumable supply item for an imaging device holds an initial or refillable volume of ink. An interior retains the ink while exit and return ports define openings through a housing to fluidly communicate the interior to the imaging device. The opening of the return port is larger than the opening of the exit port. The design slows the return of fluid to the housing which minimizes air bubbles or frothiness in the fluid. During use, ink depletes toward a bottom surface of the interior beneath which the ink is prevented from occupying. A housing section below the interior retains a portion of the exit port so that a bottom of the opening of the exit port is substantially horizontally aligned with the bottom surface. It prevents stranding ink beneath the exit port. Further embodiments include port configuration, construction, and modular components, to name a few.

Abstract: A consumable supply item for an imaging device holds an initial or refillable volume of fluid. Its housing defines an interior having a pair of opposed electrodes. The electrodes define a capacitance that varies in response to an amount of liquid between them. A volume space filled by the liquid varies along a length of the electrodes. The design facilitates abrupt changes in capacitance values at each change in the volume space. Devices can recalibrate fluid levels at these changes. Electrode interior surfaces face one another. At least one electrode has an open region, such as a hole or a cutout of material. In another design, a support material connects to each electrode to provide mechanical stability and create a region preventing filling by the liquid. Further embodiments contemplate material selection, construction, and modularity, to name a few.

Abstract: A consumable supply item for an imaging device holds an initial or refillable volume of fluid. Its housing defines an interior having a pair of opposed electrodes. The electrodes define a capacitance that varies in response to an amount of liquid between them. A volume space filled by the liquid varies along a length of the electrodes. The design facilitates abrupt changes in capacitance values at each change in the volume space. Devices can recalibrate fluid levels at these changes. Electrode interior surfaces face one another. At least one electrode has an open region, such as a hole or a cutout of material. In another design, a support material connects to each electrode to provide mechanical stability and create a region preventing filling by the liquid. Further embodiments contemplate material selection, construction, and modularity, to name a few.

Abstract: A housing defines a fluid reservoir for an imaging device. One or more exterior walls define a volume for holding ink to set a fluid backpressure in the imaging device. An opening in the walls is positioned for overflowing excessive ink from the volume to maintain the fluid backpressure within a predetermined operating range. Fluid inlets and outlets connect the reservoir to both a supply item and an ejection head. Ink flows into the reservoir from the supply item. It fills until the fluid rises to a height where it overflows back to the supply item. Less full reservoirs fill as the pump operates, while full reservoirs simultaneously return fluid back to their supply containers. Fluid does not spill from the walls.

Abstract: A consumable supply item for an imaging device holds an initial or refillable volume of ink. An interior retains the ink while exit and return ports define openings through a housing to fluidly communicate the interior to the imaging device. The opening of the return port is larger than the opening of the exit port. The design slows the return of fluid to the housing which minimizes air bubbles or frothiness in the fluid. During use, ink depletes toward a bottom surface of the interior beneath which the ink is prevented from occupying. A housing section below the interior retains a portion of the exit port so that a bottom of the opening of the exit port is substantially horizontally aligned with the bottom surface. It prevents stranding ink beneath the exit port. Further embodiments include port configuration, construction, and modular components, to name a few.

Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.

Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.

Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.

Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.