Patents by Inventor Jaspreet Singh Dhau
Jaspreet Singh Dhau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160293966Abstract: A fuel cell catalyst support material with self-healing and service on the fly properties. The material is stable and can preserve a fuel cell's activity over an extended lifetime. The approach strikes a practical balance between the optimum size of the electrocatalyst particle and the ability of the support material to self-heal under electrochemical stress. The self-healing support material allows the use of very small catalyst particles size without affecting the fuel cell's durability. This not only increases the efficiency of the fuel cell but also allows low PGM loading.Type: ApplicationFiled: March 31, 2016Publication date: October 6, 2016Inventors: Jaspreet Singh Dhau, Sesha Srinivasan, Ghazi Darkazalli
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Patent number: 8911608Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: GrantFiled: May 13, 2010Date of Patent: December 16, 2014Assignee: SRI InternationalInventors: Sunity Sharma, Jaspreet Singh Dhau
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Publication number: 20140083748Abstract: A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.Type: ApplicationFiled: December 3, 2013Publication date: March 27, 2014Applicant: SRI InternationalInventors: Sunity K. SHARMA, Francesco FORNASIERO, Jaspreet Singh DHAU
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Patent number: 8628818Abstract: A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.Type: GrantFiled: June 19, 2008Date of Patent: January 14, 2014Assignee: SRI InternationalInventors: Sunity K. Sharma, Francesco Fornasiero, Jaspreet Singh Dhau
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Publication number: 20130230667Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: ApplicationFiled: April 18, 2013Publication date: September 5, 2013Applicant: SRI InternationalInventors: Sunity Sharma, Jaspreet Singh Dhau
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Publication number: 20120100286Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: ApplicationFiled: December 30, 2011Publication date: April 26, 2012Applicant: SRI INTERNATIONALInventors: Sunity Sharma, Jaspreet Singh Dhau
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Patent number: 8124226Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: GrantFiled: April 1, 2011Date of Patent: February 28, 2012Assignee: SRI InternationalInventors: Sunity Sharma, Jaspreet Singh Dhau
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Patent number: 8110254Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: GrantFiled: September 12, 2007Date of Patent: February 7, 2012Assignee: SRI InternationalInventors: Sunity Sharma, Jaspreet Singh Dhau
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Patent number: 7989029Abstract: A method for reducing porosity of metal layers on a substrate may comprise depositing a precursor onto at least a portion of the substrate, and adding metal layers over the precursor comprising at least one cycle, wherein each cycle comprises: depositing a metal layer over the precursor, and exposing the metal layer to a breath-out solution.Type: GrantFiled: June 20, 2008Date of Patent: August 2, 2011Assignee: SRI InternationalInventors: Jaspreet Singh Dhau, Sunity K. Sharma
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Publication number: 20110174524Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: ApplicationFiled: April 1, 2011Publication date: July 21, 2011Applicant: SRI INTERNATIONALInventors: Sunity SHARMA, Jaspreet Singh DHAU
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Patent number: 7981508Abstract: The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines.Type: GrantFiled: September 12, 2007Date of Patent: July 19, 2011Assignee: SRI InternationalInventors: Sunity Sharma, Jaspreet Singh Dhau