Patents by Inventor Jasvir Jaspal

Jasvir Jaspal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRUCTURE AND METHOD TO IMPROVE CURRENT-CARRYING CAPABILITIES OF C4 JOINTS
    Publication number: 20070222073
    Abstract: A system and method comprises depositing a dielectric layer on a substrate and depositing a metal layer on the dielectric layer. The system and method further includes depositing a high temperature diffusion barrier metal cap on the metal layer. The system and method further includes depositing a second dielectric layer on the high temperature diffusion barrier metal cap and the first dielectric layer, and etching a via into the second dielectric layer, such that the high temperature diffusion barrier metal cap is exposed. The system and method further includes depositing an under bump metallurgy in the via, and forming a C4 ball on the under bump metallurgy layer.
    Type: Application
    Filed: March 21, 2006
    Publication date: September 27, 2007
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mukta Farooq, Jasvir Jaspal, William Landers, Thomas Lombardi, Hai Longworth, H. Pogge, Roger Quon