Patents by Inventor Jasvir Singh Jaspal

Jasvir Singh Jaspal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure and method to improve current-carrying capabilities of C4 joints
    Patent number: 8367543
    Abstract: A system and method comprises depositing a dielectric layer on a substrate and depositing a metal layer on the dielectric layer. The system and method further includes depositing a high temperature diffusion barrier metal cap on the metal layer. The system and method further includes depositing a second dielectric layer on the high temperature diffusion barrier metal cap and the first dielectric layer, and etching a via into the second dielectric layer, such that the high temperature diffusion barrier metal cap is exposed. The system and method further includes depositing an under bump metallurgy in the via, and forming a C4 ball on the under bump metallurgy layer.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: February 5, 2013
    Assignee: International Business Machines Corporation
    Inventors: Mukta Ghate Farooq, Jasvir Singh Jaspal, William Francis Landers, Thomas E. Lombardi, Hai Pham Longworth, H. Bernhard Pogge, Roger A. Quon