Patents by Inventor Jau-Jan Deng

Jau-Jan Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240241357
    Abstract: A compound lens includes four coaxially aligned lenses: (i) first lens and, in order of increasing distance therefrom, and on a same side thereof, (ii) a second lens, an inter-lens substrate, a third lens, and a fourth lens. The first lens and the third lens are negative lenses. The second lens and the fourth lens are positive lenses.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 18, 2024
    Inventors: I-Lung LU, Kuang-Ju WANG, Jau-Jan DENG
  • Publication number: 20240242531
    Abstract: A multiple-lens optical fingerprint reader for reading fingerprints through a display has an image sensor integrated circuit with photosensor array(s); a spacer; and multiple lenses in a microlens array, each lens of multiple lenses focuses light arriving at that lens from a finger adjacent the display through the spacer to form an image on associated photosensors on a photosensor array of the integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the fingerprint through arrayed microlenses onto a photosensor array of an integrated circuit, reading the array to overlapping electronic fingerprint images; extracting features from the overlapping electronic fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.
    Type: Application
    Filed: March 29, 2024
    Publication date: July 18, 2024
    Inventors: Tsung-Wei WAN, Wei-Ping CHEN, Jau-Jan DENG, Kuang-ju WANG
  • Publication number: 20240241347
    Abstract: A compound lens includes four coaxially aligned lenses: first lens and, in order of increasing distance therefrom and on a same side thereof, a second lens, a third lens, and a fourth lens. The first lens and the third lens are negative lenses. The second lens and the fourth lens are positive lenses. An image-side surface of the second lens and an object-side surface of the third lens have respective radii of curvature of equal magnitude.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 18, 2024
    Inventors: I-Lung LU, Jau-Jan DENG, Kuang-Ju WANG
  • Publication number: 20240244307
    Abstract: A camera lens module includes an image sensor and a sandwiched lens structure formed over the image sensor, the sandwiched lens structure including a layer lens between a first glass substrate and a second glass substrate, and a baffle formed between the layer lens and the first glass substrate or between the layer lens and the second glass substrate.
    Type: Application
    Filed: January 13, 2023
    Publication date: July 18, 2024
    Inventors: Tsung Wei Wan, Wei Ping Chen, Jau-Jan Deng
  • Publication number: 20240236465
    Abstract: A self-illuminating camera includes a camera and an illuminator. The camera includes an image sensor and a first lens of a pair of two identical lenses. The illuminator is adjacent to the camera and includes a light source and a second lens of the pair of two identical lenses. The illuminator has a field of illumination that at least partially overlaps a field of view of the camera.
    Type: Application
    Filed: January 10, 2023
    Publication date: July 11, 2024
    Inventors: I-Lung LU, Jau-Jan DENG, Wei-Ping CHEN
  • Publication number: 20240210663
    Abstract: A chip-level camera includes an image sensor; a concave L1 lens element on an inside surface of a first substrate; a convex L2 lens element on a first surface of a second substrate; a diaphragm stop on a second surface of the second substrate or on a first surface of a third substrate, the diaphragm stop between the second and third substrates; a convex L3 lens element on a second surface of the third substrate spaced from the image sensor; a first spacer holding first substrate at a predetermined distance from the second substrate; and a second spacer holding the second substrate a predetermined distance from the image sensor. In embodiments, lens element L1 has concave aspheric radius of R1, and lens L2 convex aspheric radius of R2, such that 1.3<ABS(R2/R1)<2.2 and/or lens L3 has convex aspheric radius R3, where 1.1<ABS(R3/R1)<2.4.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Inventors: Kuang-Ju WANG, Jau-Jan DENG, I-Lung LU
  • Patent number: 11943525
    Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: March 26, 2024
    Assignee: OmniVision Technologies, Inc.
    Inventors: Teng-Sheng Chen, Wei-Ping Chen, Jau-Jan Deng, Wei-Feng Lin
  • Patent number: 11892654
    Abstract: A passive speckle-suppressing diffuser includes a microlens array for diffusing a light field originating from one or more coherent light beams, and a diffractive optical element mounted in series with the microlens array and having a pixelated thickness distribution, characterized by a spatial variation across the diffractive optical element, to impose a spatially varying phase shift on the light field. The pixelated thickness distribution may be configured such that the spatially varying phase shift suppresses speckle of the light field while minimizing introduction of distinct diffraction structure.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: February 6, 2024
    Assignee: OmniVision Technologies, Inc.
    Inventors: Shih-Hsin Hsu, Jau-Jan Deng, Wei-Ping Chen
  • Patent number: 11869267
    Abstract: A multiple-lens optical fingerprint reader for reading fingerprints through a display has a spacer; and multiple microlenses with concave and convex surfaces in a microlens array, each microlens of multiple lenses focuses light arriving at that microlens from a finger adjacent the display through the spacer forms an image on associated photosensors on a photosensor array of an image sensor integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the finger through arrayed microlenses onto a photosensor array, reading the array into overlapping electronic fingerprint images; extracting features from the overlapping fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: January 9, 2024
    Assignee: OmniVision Technologies, Inc.
    Inventors: Jau-Jan Deng, Kuang-Ju Wang, Chun-Jen Wei
  • Publication number: 20230401889
    Abstract: An image sensor for imaging fingerprints has multiple photodiode groups each with field of view through a microlens determined by optical characteristics of the microlens and locations of the microlens and openings of upper and lower mask layers. Many photodiode groups have fields of view outwardly splayed from a center-direct field of view. A diameter of openings of the upper mask layer distant from the group having a center-direct field of view is larger than openings of a photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing openings in the upper mask layer of photodiode groups with outwardly splayed fields of view larger than openings in the upper mask layer associated with photodiode groups having center-direct field of view.
    Type: Application
    Filed: June 13, 2022
    Publication date: December 14, 2023
    Inventors: Jau-Jan DENG, Yi-Wei LIU
  • Patent number: 11842563
    Abstract: An optical fingerprint sensor with spoof detection includes a plurality of lenses, an image sensor including a pixel array that includes a plurality of first photodiodes and a plurality of second photodiodes, and at least one apertured baffle-layer having a plurality of aperture stops, wherein each second photodiode is configured to detect light having passed through a lens and at least one aperture stop not aligned with the lens along an optical axis. A method for detecting spoof fingerprints detected using an optical fingerprint sensor includes detecting large-angle light incident on a plurality of anti-spoof photodiodes, wherein the plurality of anti-spoof photodiodes is interleaved with a plurality of imaging photodiodes, determining an angular distribution of light based at least in part one the large-angle light, and detecting spoof fingerprints based at least in part on the angular distribution of light.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: December 12, 2023
    Assignee: OmniVision Technologies, Inc.
    Inventors: Paul Wickboldt, Jau-Jan Deng, Shih-Hsin Hsu
  • Publication number: 20230386247
    Abstract: An image sensor for imaging fingerprints has multiple photodiode groups each having a field of view determined by pinholes of upper and lower mask layers and a metal layer, each field of view being through a microlens. Many photodiode groups have fields of view outwardly splayed from a group having a center-direct field of view. A diameter of pinholes of the metal layer distant from the group having a center-direct field of view have larger diameter than a pinhole of the photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing a pinhole in the metal layer of photodiode groups with outwardly splayed fields of view larger than a pinhole associated with of photodiode groups having a center-direct field of view.
    Type: Application
    Filed: May 25, 2022
    Publication date: November 30, 2023
    Inventors: Jau-Jan DENG, Yi-Wei LIU
  • Publication number: 20230351798
    Abstract: A fingerprint sensor has an array of microlenses formed on an upper surface of a transparent substrate; with a lower surface of the transparent substrate bonded to an upper surface of a fingerprint image sensor integrated circuit. In embodiments, it includes one or two filter layers on the lower surface of the transparent substrate, and may also include masked black baffle layers on one or more of the upper and lower surface of the transparent substrate. The sensor is made by forming the microlenses and black baffle layers on the transparent substrate, then aligning the transparent substrate to a wafer of fingerprint sensor integrated circuits and bonding the transparent substrate to the wafer, then dicing the wafer into individual fingerprint sensors.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 2, 2023
    Inventors: Tsung-Wei WAN, Wei-Ping CHEN, Jau-Jan DENG
  • Patent number: 11782256
    Abstract: An endoscope imager includes a system-in-package and a specularly reflective surface. The system-in-package includes (a) a camera module having an imaging lens with an optical axis and (b) an illumination unit. The system-in-package includes (a) a camera module having an imaging lens with an optical axis and (b) an illumination unit configured to emit illumination propagating in a direction away from the imaging lens, the direction having a component parallel to the optical axis. The specularly reflective surface faces the imaging lens and forming an oblique angle with the optical axis, to deflect the illumination toward a scene and deflect light from the scene toward the camera module.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: October 10, 2023
    Assignee: OmniVision Technologies, Inc.
    Inventors: Yi-Fan Lin, Wei-Ping Chen, Jau-Jan Deng, Suganda Jutamulia
  • Publication number: 20230306778
    Abstract: An under-display optical fingerprint sensors employing microlens arrays (MLAs) and an opaque aperture layer includes high aspect-ratio metal aperture structures for efficient angular signal filtering and stray light control. Instead of relying on one or more opaque aperture baffle-layers, embodiments disclosed herein utilize an image sensor's inherent metal layers for filtering signals originated from unwanted angular ranges and blocking undesired stray light could achieve similar or better performance with simplified process flow and lower cost. Layers from the sensors' inherent metal layers are brought into the sensing area on purpose to form the high aspect-ratio metal aperture structure. The metal layers in the sensing area may include apertures aligned to apertures in the opaque layer, and may also be grounded.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 28, 2023
    Inventors: Shih-Hsin HSU, Jau-Jan DENG
  • Publication number: 20230262310
    Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Inventors: Teng-Sheng CHEN, Wei-Ping CHEN, Jau-Jan DENG, Wei-Feng LIN
  • Publication number: 20230131591
    Abstract: A multiple-lens optical fingerprint reader for reading fingerprints through a display has a spacer; and multiple microlenses with concave and convex surfaces in a microlens array, each microlens of multiple lenses focuses light arriving at that microlens from a finger adjacent the display through the spacer forms an image on associated photosensors on a photosensor array of an image sensor integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the finger through arrayed microlenses onto a photosensor array, reading the array into overlapping electronic fingerprint images; extracting features from the overlapping fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.
    Type: Application
    Filed: October 27, 2021
    Publication date: April 27, 2023
    Inventors: Jau-Jan DENG, Kuang-Ju WANG, Chun-Jen WEI
  • Publication number: 20230118866
    Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
    Type: Application
    Filed: May 18, 2022
    Publication date: April 20, 2023
    Inventors: Teng-Sheng CHEN, Wei-Ping CHEN, Wei-Feng LIN, Jau-Jan DENG
  • Publication number: 20230122722
    Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
    Type: Application
    Filed: October 18, 2021
    Publication date: April 20, 2023
    Inventors: Teng-Sheng CHEN, Wei-Ping CHEN, Jau-Jan DENG, Wei-Feng LIN, Chun-Sheng FAN
  • Publication number: 20230072103
    Abstract: An optical fingerprint sensor with spoof detection includes a plurality of lenses, an image sensor including a pixel array that includes a plurality of first photodiodes and a plurality of second photodiodes, and at least one apertured baffle-layer having a plurality of aperture stops, wherein each second photodiode is configured to detect light having passed through a lens and at least one aperture stop not aligned with the lens along an optical axis. A method for detecting spoof fingerprints detected using an optical fingerprint sensor includes detecting large-angle light incident on a plurality of anti-spoof photodiodes, wherein the plurality of anti-spoof photodiodes is interleaved with a plurality of imaging photodiodes, determining an angular distribution of light based at least in part one the large-angle light, and detecting spoof fingerprints based at least in part on the angular distribution of light.
    Type: Application
    Filed: September 8, 2021
    Publication date: March 9, 2023
    Inventors: Paul Wickboldt, Jau-Jan Deng, Shih-Hsin HSU