Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.

Abstract: A technique for providing electrostatic discharge (ESD) protection in complementary metal-oxide semiconductor (CMOS) technologies is disclosed. A power supply RC-based ESD protection circuit having an RC value in the nanosecond range increases the allowable power-up slew rate so that fast power-up events (e.g., hot-plug and power switching operations) are not erroneously interpreted as ESD events. Because the RC value is small, the layout area needed for the RC-based ESD protection circuit is also reduced.

Abstract: One embodiment sets forth a technique for providing electrostatic discharge (ESD) protection in complementary metal-oxide semiconductor (CMOS) technologies. A power supply RC-based ESD protection circuit having a RC value in the nanosecond range increases the allowable power-up slew rate so that fast power-up events (e.g., hot-plug and power switching operations) are not erroneously interpreted as ESD events. Because the RC value is small, the layout area needed for the RC-based ESD protection circuit is also reduced.

Abstract: A technique for enhancing substrate bias of grounded-gate NMOS fingers (ggNMOSFET's) has been developed. By using this technique, lower triggering voltage of NMOS fingers can be achieved without degrading ESD protection in negative zapping. By introducing a simple gate-coupled effect and a PMOSFET triggering source with this technique, low-voltage triggered NMOS fingers have also been developed in power and I/O ESD protection, respectively. A semiconductor device which includes a P-well which is underneath NMOS fingers. The device includes an N-well ring which is configured so that the inner P-well underneath the NMOS fingers is separated from an outer P-well. The inner P-well and outer P-well are connected by a P-substrate resistance which is much higher than the resistance of the P-wells. A P+-diffusion ring surrounding the N-well ring is configured to connect to VSS, i.e., P-taps.

Abstract: A technique for enhancing substrate bias of grounded-gate NMOS fingers (ggNMOSFET's) has been developed. By using this technique, lower triggering voltage of NMOS fingers can be achieved without degrading ESD protection in negative zapping. By introducing a simple gate-coupled effect and a PMOSFET triggering source with this technique, low-voltage triggered NMOS fingers have also been developed in power and I/O ESD protection, respectively. A semiconductor device which includes a P-well which is underneath NMOS fingers. The device includes an N-well ring which is configured so that the inner P-well underneath the NMOS fingers is separated from an outer P-well. The inner P-well and outer P-well are connected by a P-substrate resistance which is much higher than the resistance of the P-wells. A P+-diffusion ring surrounding the N-well ring is configured to connect to VSS, i.e., P-taps.

Abstract: A technique to enhancing substrate bias of grounded-gate NMOS fingers (ggNMOSFET's) has been developed. By using this technique, lower triggering voltage of NMOS fingers can be achieved without degrading ESD protection in negative zapping. By introducing a simple gate-coupled effect and a PMOSFET triggering source with this technique, low-voltage triggered NMOS fingers have also been developed in power and I/O ESD protection, respectively. A semiconductor device which includes a P-well which is underneath NMOS fingers. The device includes an N-well ring which is configured so that the inner P-well underneath the NMOS fingers is separated from an outer P-well. The inner P-well and outer P-well are connected by a P-substrate resistance which is much higher than the resistance of the P-wells. A P+-diffusion ring surrounding the N-well ring is configured to connect to VSS, i.e., P-taps.

Abstract: A system and method for protecting a circuit. The system includes a protection circuit that includes an inverter and a capacitor coupled to the inverter. The inverter and the capacitor are implemented using logic circuits of a circuit core, and the inverter shunts electrostatic discharge ESD current through the capacitor. According to the system and method disclosed herein, because the protection circuit shunt circuit shunts ESD current using logic circuits of the circuit core, ESD protection is achieved while not requiring large FETs. Also, the protection circuit protects circuits against ESD events that conventional FET cannot protect.

Abstract: A silicon-controlled rectifier apparatus, comprising a substrate upon which a low-voltage triggered silicon-controlled rectifier is configured. A plurality of triggering components (e.g., NMOS fingers) are formed upon the substrate and integrated with the low-voltage triggered silicon-controlled rectifier, wherein the plurality of triggering components are inserted into the low-voltage triggered silicon-controlled rectifier in order to permit the low-voltage triggered silicon-controlled rectifier to protect against electrostatic discharge during human-body model and charged-device model stress events.

Abstract: A technique to enhancing substrate bias of grounded-gate NMOS fingers (ggNMOSFET's) has been developed. By using this technique, lower triggering voltage of NMOS fingers can be achieved without degrading ESD protection in negative zapping. By introducing a simple gate-coupled effect and a PMOSFET triggering source with this technique, low-voltage triggered NMOS fingers have also been developed in power and I/O ESD protection, respectively. A semiconductor device which includes a P-well which is underneath NMOS fingers. The device includes an N-well ring which is configured so that the inner P-well underneath the NMOS fingers is separated from an outer P-well. The inner P-well and outer P-well are connected by a P-substrate resistance which is much higher than the resistance of the P-wells. A P+-diffusion ring surrounding the N-well ring is configured to connect to VSS, i.e., P-taps.

Abstract: A technique to enhancing substrate bias of grounded-gate NMOS fingers (ggNMOSFET's) has been developed. By using this technique, lower triggering voltage of NMOS fingers can be achieved without degrading ESD protection in negative zapping. By introducing a simple gate-coupled effect and a PMOSFET triggering source with this technique, low-voltage triggered NMOS fingers have also been developed in power and I/O ESD protection, respectively. A semiconductor device which includes a P-well which is underneath NMOS fingers. The device includes an N-well ring which is configured so that the inner P-well underneath the NMOS fingers is separated from an outer P-well. The inner P-well and outer P-well are connected by a P-substrate resistance which is much higher than the resistance of the P-wells. A P+-diffusion ring surrounding the N-well ring is configured to connect to VSS, i.e., P-taps.

Abstract: An improvement to a digital integrated circuit of the type having a functional circuit that is susceptible to damage from an electrostatic discharge. An electrostatic discharge protection element is placed in series with the functional circuit and disposed upstream in a normal direction of current flow from the functional circuit. The electrostatic discharge protection element includes at least one of a resistive choke that exhibits thermal runaway and an inductive choke.

Abstract: An electrostatic discharge protection circuit adapted to reduce an electrostatic discharge event on a line of an integrated circuit. The protection circuit includes an NMOS transistor having a source contact that is electrically connected to the line. A drain contact is electrically connected to a logical low voltage, and a gate contact is also electrically connected to the logical low voltage, through a resistor. A substrate bias pump is electrically connected to a back gate of the NMOS transistor, where the bias pump provides a steady state direct current negative bias during normal operation of the integrated circuit when there is no electrostatic discharge event.

Abstract: The present invention provides a system and method for electrostatic discharge (ESD) testing. The system includes a circuit that has a switch coupled to an input/output (I/O) circuit of a device under test (DUT), a charge source coupled to the switch, and a control circuit coupled to the switch, wherein the control circuit turns on the switch to discharge an ESD current from the charge source to the I/O circuit, and wherein the circuit is integrated into the DUT. According to the system and method disclosed herein, the system provides on-chip ESD testing of a DUT without requiring expensive and specialized test equipment.

Abstract: Design and optimization of NMOS drivers using a self-ballasting ESD protection technique in a fully silicided CMOS process. Silicided NMOS fingers which include segmented drain diffusion. Specifically, the segmented drain diffusion provides self-ballasting resistors which improves the ESD performance. Preferably, the width of the each diffusion resistor is relatively small, as this can improve a non-uniform silicidation process. The resistance of the segmented diffusion resistors is determined by their width and length, and effectively increases the ballasting effect of parasitic n-p-n bipolar transistors.

Abstract: An improvement to a digital integrated circuit of the type having a functional circuit that is susceptible to damage from an electrostatic discharge. An electrostatic discharge protection element is placed in series with the functional circuit and disposed upstream in a normal direction of current flow from the functional circuit. The electrostatic discharge protection element includes at least one of a resistive choke that exhibits thermal runaway and an inductive choke.

Abstract: An electrostatic discharge protection circuit adapted to reduce an electrostatic discharge event on a line of an integrated circuit. The protection circuit includes an NMOS transistor having a source contact that is electrically connected to the line. A drain contact is electrically connected to a logical low voltage, and a gate contact is also electrically connected to the logical low voltage, through a resistor. A substrate bias pump is electrically connected to a back gate of the NMOS transistor, where the bias pump provides a steady state direct current negative bias during normal operation of the integrated circuit when there is no electrostatic discharge event.

Abstract: A silicon-controlled rectifier apparatus, comprising a substrate upon which a low-voltage triggered silicon-controlled rectifier is configured. A plurality of triggering components (e.g., NMOS fingers) are formed upon the substrate and integrated with the low-voltage triggered silicon-controlled rectifier, wherein the plurality of triggering components are inserted into the low-voltage triggered silicon-controlled rectifier in order to permit the low-voltage triggered silicon-controlled rectifier to protect against electrostatic discharge during human-body model and charged-device model stress events.

Abstract: The present invention provides a system and method for electrostatic discharge (ESD) testing. The system includes a circuit that has a switch coupled to an input/output (I/O) circuit of a device under test (DUT), a charge source coupled to the switch, and a control circuit coupled to the switch, wherein the control circuit turns on the switch to discharge an ESD current from the charge source to the I/O circuit, and wherein the circuit is integrated into the DUT. According to the system and method disclosed herein, the system provides on-chip ESD testing of a DUT without requiring expensive and specialized test equipment.

Abstract: A system and method for protecting a circuit. The system includes a protection circuit that includes an inverter and a capacitor coupled to the inverter. The inverter and the capacitor are implemented using logic circuits of a circuit core, and the inverter shunts electrostatic discharge ESD current through the capacitor. According to the system and method disclosed herein, because the protection circuit shunt circuit shunts ESD current using logic circuits of the circuit core, ESD protection is achieved while not requiring large FETs. Also, the protection circuit protects circuits against ESD events that conventional FET cannot protect.

Abstract: An implantation method to improve ESD robustness of thick-oxide grounded-gate NMOSFET's in deep-submicron CMOS technologies. Based on standard process flow in DGO, a thick gate-oxide ESD device is improved. Instead of using the standard I/O device, the ESD device uses the thin-oxide N-LDD implantation, and thus its ESD robustness is enhanced. This is performed by updating the logic Boolean operations of thick gate-oxide and thin gate-oxide N-LDD before fabricating the masks. In TGO, the intermediate-oxide ESD uses thin-oxide N-LDD implantation, and the thick-oxide ESD uses intermediate-oxide N-LDD implantation.