Abstract: A process for sawing a substrate strip marks corresponding to substrate areas of substrate strips which are arranged side-by-side on a plate. A saw machine is mechanically moved to the substrate areas and positioned by the alignment marks of corresponding substrate areas for cutting the substrate areas of the substrate strips in the first phase. Then the saw machine is further mechanically moved to the substrate areas again and is positioned by the alignment marks of corresponding substrate areas again for cutting the substrate areas of the substrate strips in the second phase. Therefore, an error in any of the substrate areas in the first phase and second phase will not accumulate to the subsequent substrate areas in the substrate strip.

Abstract: The substrate sawing process for a strip mainly includes multi-alignment corresponding to a plurality of substrate areas of strips which are arranged side-by-side on a plate. A saw machine is mechanically moved to the substrate areas and is positioned by the alignments of corresponding substrate areas for cutting the substrate areas of the strips in the first phase. Then the saw machine is further mechanically moved to the substrate areas again and is positioned by the alignments of corresponding substrate areas again for cutting the substrate areas of the strips in the second phase. Therefore, an error in any of the substrate areas in the first phase and second phase cannot add to the peripheral substrate areas.

Abstract: A sucker for transferring packaged semiconductor devices is provided, which includes a position rod, an elastic buffer and a sponge. The position rod defines an air extraction channel in an axial direction thereof. The elastic buffer pad defines an aperture to hold an end of the position rod and a first air hole communicated with the aperture and the air extraction channel. The sponge is attached to the elastic buffer pad. The sponge defines a second air hole communicated with the first air hole. Therefore, when air is extracted through the air holes and air extraction channel, the sponge is provided with an absorbent force to securely catch a packaged semiconductor device.