Abstract: A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r1. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r2, wherein r1<r2?0.8 and r2?r1?0.025.

Abstract: An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Abstract: A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r1. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r2, wherein r1<r2?0.8 and r2?r1?0.025.

Abstract: An electrochromic composition, an electrochromic layer and an electrochromic device are provided. The electrochromic composition includes 20-80 parts by weight of polyimide, 20-80 parts by weight of silicon oxide nanoparticle, 1-50 parts by weight of electrochromic material, and 850 to 1200 parts by weight of solvent. The polyimide is a reaction product of a dianhydride and a diamine. The dianhydride and the diamine are as defined in the specification.

Abstract: An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.

Abstract: A photosensitive composition and a photoresist are provided. The photoresist is formed by compounding a photosensitive composition. The photosensitive composition includes a binder agent, a first photomonomer, and a photo initiator. The first photomonomer has at least a lactic oligomer and at least two unsaturated acrylic functional groups, wherein the first photomonomer has an amount of about 25-95 parts by weight relative to 100 parts by weight of a solid content of the binder agent. The photoinitiator has an amount of about 0.5-15 parts by weight relative to 100 parts by weight of the solid content of the binder agent.

Abstract: A photosensitive composition and a photoresist are provided. The photoresist is formed by compounding a photosensitive composition. The photosensitive composition comprises a binder agent, a photomonomer and a photoinitiator. The binder agent has a chemical structure comprising following repeating unit: R1 is H or CH3, n is 2-40 of integer. The photomonomer has an amount of about 25-95 parts by weight relative to 100 parts by weight of a solid content of the binder agent. The photo initiator has an amount of about 0.5-15 parts by weight relative to 100 parts by weight of the solid content of the binder agent.

Abstract: A photosensitive composition and a photoresist are provided. The photoresist is formed by compounding a photosensitive composition. The photosensitive composition includes a binder agent, a first photomonomer, and a photo initiator. The first photomonomer has at least a lactic oligomer and at least two unsaturated acrylic functional groups, wherein the first photomonomer has an amount of about 25-95 parts by weight relative to 100 parts by weight of a solid content of the binder agent. The photoinitiator has an amount of about 0.5-15 parts by weight relative to 100 parts by weight of the solid content of the binder agent.

Abstract: A resin composition, a resin and a method for manufacturing the same. The resin composition includes a plant oil derivative, and a multifunctional carboxylic acid, anhydride compound or a copolymer containing anhydride. The multifunctional carboxylic acid, the anhydride compound or the copolymer containing anhydride has an amount of 5-60 parts by weight relative to 100 parts by weight of the plant oil derivative.

Abstract: The invention provides a liquid crystal display, which includes an LCD panel and a first polarizing film and a second polarizing film respectively formed on the two sides of the LCD panel, wherein the first polarizing film is directly formed on the LCD panel, and the first polarizing film and a second polarizing film respectively includes a polarizer and a first pressure sensitive adhesive (PSA) and a second PSA formed on the two sides of the polarizer, wherein the first PSA is closer to the LCD panel than the second PSA, and the first PSA of the first polarizing film is directly formed on the LCD panel.

Abstract: A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

Abstract: A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.

Abstract: The present invention discloses a process for preparing a water-dispersible photosensitive composition, including the steps of: (a) adding an unsaturated photomonomer and/or a plasticizer to a carboxyl-group bearing acrylic resin solution which contains at least an organic solvent; (b) distilling and removing said organic solvent to form a resin paste; (c) dissolving a photoinitiator and an alkaline into said resin paste; (d: adding deionized water and mixing thoroughly to form an emulsion; and (e) adjusting the viscosity or said emulsion with a water-soluble resin.