Patents by Inventor Java Zhu

Java Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded SiP package with reinforced solder columns
    Patent number: 8878346
    Abstract: An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: November 4, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang Hua Java Zhu, Jack Chang-Chien, Cheemen Yu
  • Method of reducing memory card edge roughness by edge coating
    Patent number: 7994647
    Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.
    Type: Grant
    Filed: October 11, 2010
    Date of Patent: August 9, 2011
    Assignee: SanDisk Technologies Inc.
    Inventors: Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar
  • METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY EDGE COATING
    Publication number: 20110024891
    Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.
    Type: Application
    Filed: October 11, 2010
    Publication date: February 3, 2011
    Applicant: SANDISK CORPORATION
    Inventors: Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar
  • Method of reducing memory card edge roughness by edge coating
    Patent number: 7811859
    Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: October 12, 2010
    Assignee: SanDisk Corporation
    Inventors: Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar
  • METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY EDGE COATING
    Publication number: 20090085232
    Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.
    Type: Application
    Filed: September 28, 2007
    Publication date: April 2, 2009
    Inventors: Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar
  • Method of reducing mechanical stress on a semiconductor die during fabrication
    Patent number: 7435624
    Abstract: A method of reducing mechanical stress on an integrated circuit is disclosed including applying solder columns to the substrate for adding structural support to the package during the fabrication process.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: October 14, 2008
    Assignee: SanDisk Corporation
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang hua Java Zhu, Jack Chang-Chien, Cheemen Yu
  • Molded SiP package with reinforced solder columns
    Publication number: 20070252254
    Abstract: An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang hua Java Zhu, Jack Chang-Chien, Cheemen Yu
  • Method of reducing mechanical stress on a semiconductor die during fabrication
    Publication number: 20070254407
    Abstract: A method of reducing mechanical stress on an integrated circuit is disclosed including applying solder columns to the substrate for adding structural support to the package during the fabrication process.
    Type: Application
    Filed: April 28, 2006
    Publication date: November 1, 2007
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang Java Zhu, Jack Chang-Chien, Cheemen Yu