Patents by Inventor Java Zhu

Java Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing memory card edge roughness by edge coating
    Patent number: 7994647
    Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.
    Type: Grant
    Filed: October 11, 2010
    Date of Patent: August 9, 2011
    Assignee: SanDisk Technologies Inc.
    Inventors: Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar
  • METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY EDGE COATING
    Publication number: 20110024891
    Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.
    Type: Application
    Filed: October 11, 2010
    Publication date: February 3, 2011
    Applicant: SANDISK CORPORATION
    Inventors: Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar
  • Method of reducing memory card edge roughness by edge coating
    Patent number: 7811859
    Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: October 12, 2010
    Assignee: SanDisk Corporation
    Inventors: Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar
  • METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY EDGE COATING
    Publication number: 20090085232
    Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.
    Type: Application
    Filed: September 28, 2007
    Publication date: April 2, 2009
    Inventors: Ong King Hoo, Java Zhu, Ning Ye, Hem Takiar