Abstract: An aspirator jet suction pick-up device for moving green sheets or other flexible materials employs a source of gas under positive pressure into the head with exhaust via a network of slots disposed along the pick-up surface of the head. As the gas exhausts through the ends of the slots via a manifold or plenum, an open groove on the pick-up surface entrains aspirated air causing a localized suction force. The suction force due to aspiration uniformly and stably holds a flexible sheet on the pick-up surface.

Abstract: A transport system is disclosed, including an air film shuttle conveyor for conveying semiconductor chips from a loading to an unloading station, the conveyor comprising a base plate and upstanding side guide walls extending longitudinally of the base plate, the guide walls being spaced apart a distance slightly greater than the lateral dimension of said chips; further included are means providing a laminar air flow which surrounds the chips and forms an air film supporting them and propelling them downstream such that the slight spacing between the chips and the guide walls causes the flow resistance to be higher in the one region defined by said slight spacing than in the region defined by the spacing between the chips, whereby a continuous and flexible separation action occurs between the chips.

Abstract: A manufacturing processing system comprises a plurality of processing stations, preferably vacuum stations, interconnected by air track, preferably an axi-radial air track with novel sections rotatable about a transverse axis in the plane of the track and normal to the travel of the objects, hereafter referred to as swivelators. Certain of the swivelators are formed with axial movable portions capable of moving beyond the plane of the air track surface and returning to the plane, so that these swivelators can pick up and set down objects in predetermined positions in the manufacturing processing station with an air force so as to not make physical contact with the objects. A novel gas lock device is positioned in the air track between those processing stations, in which the gas pressure must be separated so as to essentially eliminate the possibility of gas contaminant passing from one station to the next.

Abstract: A method and apparatus for obtaining a uniform gaseous molecular field under high vacuum conditions encountered in a dry etching process. In the method a source of a gas is provided and introduced into a manifold. The manifold feeds at least one nozzle and the gas is passed through the manifold and through the nozzle into a chamber maintained under vacuum conditions. The pressure of the gas and the configuration of the manifold and nozzle are such that the gas is caused to exit from the nozzle into the chamber under vacuum at sonic velocity.

Abstract: A contactless air film lift-up device constructed to utilize the pressure-velocity relationship expressed in the Bernoulli principle to provide a desired pick-up action, while at the same time generating a lateral restraining force through a further utilization of the Bernoulli principle.

Abstract: This specification deals with the stopping, positioning, orienting and redirecting a semiconductor wafer being transported along a track on an air film or bed of air. The stopping mechanism is an air jet located in a groove in the track, wafers passing over this air jet on an air film are sensed by a pneumatic sensor that turns on the air jet to set up an air stream under the transporting surface of the air film. This air stream sucks the fluid in the air film along with it in the groove causing a vacuum in the bed in the area of the nozzle of the air jet. The wafers are then stopped by the suction of the vacuum. Positioning, orienting and redirecting is done using the air jet and pneumatic sensor in combination with special air jet arrangements and operations.

Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined position relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position to the workpiece relative to a fixed reference and emits a signal output which is compared, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site.

Abstract: Apparatus for positioning a workpiece and tool in a precise location relative to each other by positioning in a predetermined site the workpiece, and then positioning the tool in a precise predetermined positon relative to the site in minimum total time. The apparatus comprises a closed loop position and velocity sensitive servo system connected to the workpiece, the servo system including positioning apparatus for positioning the workpiece in a predetermined site. A position indicator determines the actual position of the workpiece relative to a fixed reference and emits a signal output which is compared, in an error generator, with the desired position of the workpiece relative to the reference. The difference signal, from the error generator, is applied to the positioner and is used to bring the workpiece into the site. The positioner is provided with velocity feedback which cooperates with the positioning signal from the error generator to drive the workpiece into the predetermined site.

Abstract: A semiconductor wafer, which has chips formed thereon, is moved from a class 100 environment into a vacuum chamber in which pattern writing is performed on the chips by an electron beam without significantly affecting the vacuum level in the vacuum chamber. The wafer is initially disposed on an elevator, which is within the vacuum chamber, through an opening, which is vacuum sealed by the elevator at this time, in the top wall of the vacuum chamber. A lid is then placed over the opening from the exterior to cooperate with the elevator to form an ante chamber which the wafer disposed therein. The ante chamber, which is purged prior to the lid being placed over the opening, is then reduced to a vacuum of 5 .times. 10.sup..sup.-2 torr. The elevator then lowers the wafer into a horizonal plane in which a transfer mechanism is located to transfer the wafer from the elevator to an X-Y table on which the wafer is mounted for pattern writing of the chips. The transfer mechanism includes an arm, which is indexed 180.