Abstract: A torsional damper according to the present disclosure includes an inner sleeve and an outer sleeve. The inner sleeve is configured to couple with a shaft, arranged concentrically with an axis of rotation. The inner sleeve has a generally annular profile with a periphery and a male spline extending from the periphery. The outer sleeve is disposed about the inner sleeve, and arranged concentrically with the inner sleeve. The outer sleeve has a generally annular profile with a periphery and a female spline recessed within the periphery. The inner and outer sleeves are arranged with the male spline disposed within the female spline. The damper additionally includes a resilient coupler arranged between the male spline and the female spline. The damper further includes a ball disposed between the inner sleeve and the outer sleeve and configured to inhibit radial motion of the outer sleeve relative to the inner sleeve.

Abstract: A novel processes for the preparation of suvorexant (formula I), its related compounds and its intermediates that are simple, economical and commercially viable.

Abstract: Methods, systems, and apparatuses for semiconductor devices are provided herein. A semiconductor device includes an array of conductive pads for signals. One or more non-linear compliant springs may be present to route signals from the conductive pads to interconnect pads formed on the semiconductor device to attach bump interconnects. Each non-linear compliant spring may include one or more routing segments. The semiconductor device may be mounted to a circuit board by the bump interconnects. When the semiconductor device operates, heat may be generated by the semiconductor device, causing thermal expansion by the semiconductor device and the circuit board. The semiconductor device and circuit board may expand by different amounts due to differences in their thermal coefficients of expansion. The non-linear compliant springs provide for compliance between the conductive pads and bump interconnects to allow for the different rates of expansion.

Abstract: The present application provide processes for the preparation of fingolimod and its pharmaceutically acceptable salts, process for the purification of fingolimod hydrochloride and process for the preparation of amorphous fingolimod hydrochloride.

Abstract: Provided are crystalline and amorphous vilazodone hydrochloride. Further provided are amorphous solid dispersions of vilazodone hydrochloride with pharmaceutically acceptable carries. Also provided is a process for the preparation of form I of vilazodone free base.

Abstract: A vehicle differential unit (DU), including: a torsional damper assembly having a plurality of independently sprung damper assemblies positioned with respect to the DU, each damper assembly configured to reduce noise or vibration generated by the DU in a predetermined frequency range.

Abstract: A vehicle differential unit (DU), including: a torsional damper assembly having a plurality of independently sprung damper assemblies positioned with respect to the DU, each damper assembly configured to reduce noise or vibration generated by the DU in a predetermined frequency range.

Abstract: The present application provide processes for the preparation of fingolimod and its pharmaceutically acceptable salts, process for the purification of fingolimod hydrochloride and process for the preparation of amorphous fingolimod hydrochloride.

Abstract: Methods, systems, and apparatuses for semiconductor devices are provided herein. A semiconductor device includes an array of conductive pads for signals. One or more non-linear compliant springs may be present to route signals from the conductive pads to interconnect pads formed on the semiconductor device to attach bump interconnects. Each non-linear compliant spring may include one or more routing segments. The semiconductor device may be mounted to a circuit board by the bump interconnects. When the semiconductor device operates, heat may be generated by the semiconductor device, causing thermal expansion by the semiconductor device and the circuit board. The semiconductor device and circuit board may expand by different amounts due to differences in their thermal coefficients of expansion. The non-linear compliant springs provide for compliance between the conductive pads and bump interconnects to allow for the different rates of expansion.

Abstract: The present application provides novel thiazole derivatives that are useful as activators of Adenosine 5?-Monophosphate-Activated Protein Kinase and pharmaceutical compositions containing such compounds.

Abstract: In accordance with one aspect, the present invention provides a compound of general formula (I), its stereoisomers thereof and/or its pharmaceutically acceptable salts thereof, which have antibacterial activity; with methods of treating infectious diseases in warm blooded animals employing these new compounds. wherein R1 is selected from optionally substituted alkyl.

Abstract: The present invention relates to novel propionic acid derivatives. More particularly, the present invention relates to beta-phenyl alpha-oxysubstituted propionic acids of the general formula (I). The present invention also relates to processes for the preparation of compounds of the formula (I) and their use in the preparation of compounds of formula (II).

Abstract: The present invention relates to novel oxazolidinone compounds of formula (I) with antibacterial activity, their pharmaceutically acceptable salts, their stereoisomers, their prodrugs, pharmaceutical compositions comprising the same and to their use as therapeutic agents

Abstract: The present invention is directed to a compounds, methods and compositions for making the compounds and methods of treating a variety of diseases and disease states including atherosclerosis, arthritis, restenosis, diabetic nephropathy, or dyslipidemia, or disease states mediated by the low expression of Perlecan, comprising the administration of new heterocyclic compounds, particularly substituted pyrimidines.

Abstract: The present invention provides new heterocyclic compounds, particularly substituted pyridines, methods and compositions for making and using these heterocyclic compounds, and methods for treating a variety of diseases and disease states, including atherosclerosis, arthritis, restenosis, diabetic nephropathy, or dyslipidemia, or disease states mediated by the low expression of Perlecan.

Abstract: The present invention relates to novel antidiabetic, hypolipidemic, antiobesity and hypocholesterolemic compounds of formula (I), their derivatives, their analogs, their tautomeric forms, their stereoisomers, their polymorphs, their pharmaceutically acceptable salts, their pharmaceutically acceptable solvates and pharmaceutically acceptable compositions containing them.

Abstract: In accordance with one aspect, the present invention provides a compound of general formula (I), its stereoisomers thereof and/or its pharmaceutically acceptable salts thereof, which have antibacterial activity; with methods of treating infectious diseases in warm blooded animals employing these new compounds. wherein R1 is selected from optionally substituted alkyl.

Abstract: The present application provides novel thiazole derivatives that are useful as activators of Adenosine 5?-Monophosphate-Activated Protein Kinase and pharmaceutical compositions containing such compounds.

Abstract: There are provided derivatives having PPAR agonist activity. The derivatives include compounds and/or their pharmaceutically acceptable salts; the compounds having the formula (I) wherein A has the structure (II) or (III); X is chosen from —CH2—, —O—, —NH—, and —S—; Y is chosen from —O—, —NH—, and —S—; Z, which may be located in any position of substitution, is hydrogen or halogen; R1 and R2, which may be the same or different, are independently chosen from hydrogen and C1-C8 alkyl, or R1 and R2 together form a carbocyclic ring having from 4 to 6 carbon atoms; R3 is chosen from hydrogen and C1-C8 alkyl; R4, R5, and R6, which may be the same or different, are independently chosen from hydrogen and C1-C8 alkyl; and n is 1 to 6. Various embodiments and variants are provided.

Abstract: The present invention relates to novel antidiabetic, hypolipidemic, antiobesity and hypocholesterolemic compounds of formula (I) their derivatives, their analogs, their tautomeric forms, their stereoisomers, their polymorphs, their pharmaceutically acceptable salts, their pharmaceutically acceptable solvates and pharmaceutically acceptable compositions containing them, to a process for preparing such compounds. More particularly, the present invention relates to novel alkyl carboxylic acids of the general, their derivatives, their analogs, their tautomeric forms, their stereoisomers, their polymorphs, their pharmaceutically acceptable salts, their pharmaceutically acceptable solvates and pharmaceutically acceptable compositions containing them, to a process for preparing such compounds.